Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Xiaomi Cannot Develop A Future In-House XRING Chipset Using TSMC’s 2nm Process Because Of The U.S. Crackdown On Specialized EDA Tools, Company Will Be Limited To The ‘N3E’ Node Omar Sohail • Jun 5, 2025 at 04:28am EDT The XRING 01 is a technological milestone, not just for Xiaomi, but it is also regarded as an achievement for China, and one that would make the U.S. government very nervous, because, like current-generation chipsets, the in-house solution has been mass produced on TSMC’s 3nm ‘N3E’ process. Unfortunately, Xiaomi’s progress might not scale past this threshold because the Trump administration has banned the export of EDA tools that are necessary to successfully fabricate a 2nm SoC. Tipster claims that EDA tools are mandatory in designing GAAFET structures, meaning that Xiaomi and its XRING division will be limited to TSMC’s ‘N3E’ node Since TSMC’s 2nm technology has a GAAFET structure, Weibo tipster Digital Chat Station states that it is imperative that Xiaomi gets hold of those EDA, or Electronic Design Automation tools. The Taiwanese semiconductor giant was reported to have begun accepting orders for 2nm wafers from April 1, with each unit estimated to cost Among the regular trio of Apple, Qualcomm, and MediaTek, Xiaomi would count itself as one of TSMC’s customers. Sadly, with the recent development, the Chinese firm will be limited to the 3nm N3E node, facing a similar fate to Huawei. The latest claim also suggests that to possess the latest and greatest hardware in smartphone chipset technology, Xiaomi will have little choice but to continue relying on Qualcomm and MediaTek, which will unveil the Snapdragon 8 Elite Gen 2 and Dimensity 9500 later this year. Fortunately, restricting exports of cutting-edge machinery to China will only boost its resolve to continue the production of local EDA tools, but will this hardware be developed fast enough for the Xiaomi XRING 02 to be fabricated on TSMC’s 2nm process? We will have the answer to this question in the future. Readers should note that there is also the risk that the Trump administration enforces a massive ban on Xiaomi, preventing the latter from doing business with TSMC or Samsung in any way, shape, or form. While China is pursuing the manufacturing of custom EUV machinery to eliminate any overseas trade involvement, it may take several years for the country to achieve autonomy. News Source: Digital Chat Station Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada #xiaomi #cannot #develop #future #inhouse

Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Mobile Xiaomi Will Eventually Branch Out Its Custom Chipsets For Non-Flagship Smartphones, And Intends To Go Down Apple’s Path By Launching A 5G Solution Omar Sohail • May 27, 2025 at 01:08pm EDT The XRING 01 is just the base of what Xiaomi has in store for future smartphone releases, starting with the company making history by becoming the first Chinese firm to introduce a silicon mass produced on the 3nm process. Eventually, we shall witness the launch of more SoCs tailor-made for the affordable options, with an executive stating that these plans do not just stop here. Similar to Apple’s C1 5G modem, Xiaomi also wants to materialize a baseband chip, but has yet to provide a concrete launch timeline. While Xiaomi will open up its technology to various smartphone lineups, its core focus currently lies in the flagship range So far, the XRING 01 is currently found in the Xiaomi 15S Pro and the Pad 7 Ultra, and both of them are currently occupying the premium space of their respective categories. The company made the right decision to introduce a flagship custom SoC because it is solid proof that the silicon can compete with the heavy hitters from Qualcomm, MediaTek, and Apple, which have been developing solutions for years. However, Xiaomi will not keep itself limited to the top-end products, because @SKundojjala posted a statement on X from Lu Weibing, a company partner, regarding future plans. Currently, Xiaomi wants to focus on the flagship space, but will eventually extend its efforts to the more affordable range. Additionally, the statement mentions that the Chinese technology superstar wants to develop its modem, following in the footsteps of Apple and its C1 5G baseband chip. However, just because a plan is in the pipeline does not necessarily mean that it will be executed immediately, because the Xiaomi executive states that ‘we are just taking off.’ Xiaomi gives itself 5-10 years to achieve reasonable financial model with smartphone chips. XRING's initial focus is flagship only and Xiaomi will look into developing multi-mode 5G chips in the future. Says it's early to talk about incremental GM. pic.twitter.com/gimKuzFOX5 — Sravan KundojjalaMay 27, 2025 It could take several years before we witness a custom 5G modem, with Xiaomi likely running into the same development roadblocks as Apple. Another option for the company is to utilize existing technology, such as the XRING 01, in more affordable smartphones and tablets, but that is only when its successor arrives in the near future. Keep in mind that there is a binned version of the XRING 01 that currently fuels the Pad 7 Ultra, giving the company yet another alternative to reduce costs while equipping its non-flagship smartphones with top-end parts. News Source: @SKundojjala Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada #xiaomi #will #eventually #branch #out

The arrival of the XRING 01 is a message from Xiaomi that it is fully prepared and equipped to design and manufacture custom chipsets, securing a new milestone by becoming the first Chinese firm to successfully commercialize a 3nm SoC. While the new silicon’s launch would indicate that the company is ready to wave goodbye to its partners Qualcomm and MediaTek, a new estimate reveals that it may take several years before Xiaomi is completely self-sufficient in making its own chipsets. For now, around 40 percent of the company’s smartphones feature parts from the aforementioned names. Relying on Qualcomm and MediaTek for future chipsets might still be a necessity, considering that the U.S. has not voiced its concern for Xiaomi’s XRING 01 Currently, the XRING 01 powers the Xiaomi 15S Pro and the Xiaomi Pad 7 Ultra, and there is no mention of whether the custom SoC will make its way to other devices. The company has not mentioned how many units it intends to manufacture but utilizing the second-generation 3nm process from TSMC, also known as ‘N3E,’ is a costly decision, not to mention that the tape-out process likely racked up a bill of millions for Xiaomi. In the long run, it is cheaper to make your own chipsets as opposed to sourcing from Qualcomm or MediaTek, but in the initial stages, where a ton of trial and error is involved, there is no question that Xiaomi’s investment of billions was absolutely crucial. However, the company has barely scratched the surface, and until it has successfully adopted its in-house silicon for at least a couple of generations, we doubt the partnership with Qualcomm and MediaTek will evaporate. In fact, CNBC reports that, according to Counterpoint Research Partner Niel Shah, 40 percent of Xiaomi smartphones continue to feature chipsets from Qualcomm and MediaTek. These two might be included in Xiaomi’s supply chain for a little longer because of the potential U.S. export controls looming over the company’s head like the sword of Damocles. The XRING 01 represents not just a victory for Xiaomi but also for China, and leveraging TSMC’s advanced lithography will probably not go unnoticed by the Trump administration. There is the possibility that TSMC is barred from doing business with Xiaomi for fear that the latter’s technology could be distributed to other Chinese firms and give them an edge in the technological race. The problem is that the global landscape is too unpredictable to make such assumptions, so we must see what fate awaits Xiaomi in the future. News Source: CNBC Deal of the Day #xiaomis #xring #does #not #mean

After fifteen years of semiconductor research, Xiaomi unveils its inaugural custom processor, the XRING O1. This proprietary chip now drives two flagship devices that showcase how engineering can follow aesthetic vision rather than dictate it. The 15S Pro smartphone and Pad 7 Ultra tablet demonstrate a maturation in hardware development where technical capabilities enhance design intentions instead of limiting them. Designer: Xiaomi The XRING O1 represents a significant departure from Xiaomi’s previous reliance on third-party processors. Built on advanced 3-nanometer fabrication technology, this chip architecture balances computational prowess with practical energy management. Its ten-core configuration includes dual high-performance cores operating at 3.7GHz alongside efficiency-focused cores that handle routine tasks without unnecessary power drain. Graphics processing receives substantial attention through the integrated 16-core Immortalis-G925 GPU. This component renders complex visual content with exceptional smoothness, particularly beneficial when working with creative applications or editing high-resolution video. The processor’s specialized imaging engine processes 8.7 billion pixels per second, enabling sophisticated computational photography features without compromising system responsiveness. 15S Pro: Hardware Design Enhancing Photographic Capability The 15S Pro demonstrates thoughtful material selection through its Dragon Scale Fiber and Far Sky Blue variants. These finishes transcend mere aesthetics, communicating product identity through both visual and tactile characteristics. The aluminum frame incorporates an innovative wing-shaped cooling system that maintains optimal thermal conditions without disrupting the device’s clean lines. Visual content benefits from the 6.73-inch OLED panel capable of 3200 nits peak brightness. This specification translates to practical benefits in outdoor environments where ambient light typically overwhelms conventional displays. The implementation of variable refresh rate technology, spanning from 1Hz to 120Hz, preserves battery reserves during static content viewing while ensuring fluid motion when required. The 2K resolution maintains clarity across all content types. Photographic capabilities receive particular emphasis through collaboration with Leica. The Summilux lens system pairs with three 50-megapixel sensors, each optimized for specific capture scenarios. The primary camera employs an f/1.62 aperture and 1/1.31″ sensor that gather substantial light even in challenging conditions. Complementary ultrawide and 5X telephoto modules expand creative possibilities without quality compromises. The XRING O1’s dedicated image signal processor enables sophisticated computational photography techniques. The system applies intelligent enhancement that respects photographic intent rather than applying excessive processing. Low-light photography, portrait effects, and high dynamic range scenarios benefit from this approach, producing results that rival dedicated cameras in many situations. Power management demonstrates similar attention to practical user needs. The 6100mAh silicon-carbon battery achieves 850Wh/L energy density, providing substantial capacity within reasonable physical dimensions. When recharging becomes necessary, 90W wired and 50W wireless options minimize downtime. The XRING O1’s efficiency optimizations extend operational duration during active use. Pad 7 Ultra: Rethinking Tablet Proportions The Pad 7 Ultra challenges conventional tablet design through its remarkably thin 5.1mm profile. This svelte form houses a 14-inch OLED display that transforms content consumption and creation through both size and quality. The 3.2K resolution ensures exceptional clarity across all applications, while the 120Hz refresh rate creates immediate responsiveness during interaction. The 3:2 aspect ratio represents a particularly thoughtful design decision that enhances productivity applications. This format provides additional vertical space compared to widescreen alternatives, benefiting document editing, web browsing, and creative software. The choice demonstrates how subtle proportion adjustments can significantly impact practical usability. Construction employs an all-metal unibody approach that achieves 609g weight despite the generous display dimensions. The high-strength aluminum alloy increases structural integrity by 18% compared to previous generations, creating a device that feels substantial without unnecessary mass. This balance ensures comfortable handling during extended creative sessions. The optional nano-soft light screen variant addresses the needs of digital artists and note-takers. Surface treatment reduces reflectivity by 70% and glare by 99%, creating a more paper-like experience for stylus input. When paired with the Focus Touch Pen offering 8192 pressure sensitivity levels and minimal latency, the tablet provides professional-grade creative capabilities in an exceptionally portable format. Performance improvements enabled by the XRING O1 translate to measurable productivity benefits. Video exports complete 27.5% faster than previous generations, while image processing finishes 51.3% quicker. Multitasking demonstrates 49% improved responsiveness, allowing users to maintain creative momentum without technical interruptions. Audio reproduction receives similar attention through an eight-speaker system with Dolby Atmos support. This configuration creates immersive soundscapes that complement the visual experience, enhancing both entertainment content and creative audio work. The approach demonstrates consideration for the complete user experience rather than focusing exclusively on visual elements. Custom Silicon Enabling Design Freedom The XRING O1 represents more than technical achievement. It enables design approaches previously constrained by processing or efficiency limitations. By controlling both hardware and silicon development, Xiaomi creates devices where form and function achieve greater harmony than typically possible when adapting designs around third-party components. This integration allows both the 15S Pro and Pad 7 Ultra to challenge conventional expectations while delivering substantive performance improvements. The processor’s efficiency enables the Pad 7 Ultra’s remarkably thin profile without thermal or battery compromises. Similarly, the 15S Pro maintains consistent performance during demanding photographic tasks without requiring design concessions for cooling. Xiaomi’s approach demonstrates how custom silicon development can advance product design beyond incremental refinements. The XRING O1 provides capabilities specifically tailored to hardware priorities rather than forcing design compromises to accommodate standardized processors. This strategy allows greater creative freedom while maintaining competitive performance metrics. The 15S Pro enters the market at 5,499 yuanfor configurations with 16GB RAM and 512GB storage. This positioning balances premium capabilities with accessibility, making advanced technology available to more users. The Pad 7 Ultra similarly offers distinctive design and performance characteristics at competitive price points, challenging established premium tablet offerings.The post Xiaomi Debuts Custom Silicon: XRING O1 Transforms 15S Pro and Pad 7 Ultra first appeared on Yanko Design. #xiaomi #debuts #custom #silicon #xring

Xiaomi 15S Pro was launched in China on Thursday. This is the first handset from the Chinese OEM to be equipped with its in-house 3nm 10-core XRING 01 chipset. The phone supports 16GB of LPDDR5X RAM paired with up to 1TB of UFS 4.0 inbuilt storage and ships with Android 15-based HyperOS 2.0. The Xiaomi 15s Pro carries a Leica-backed 50-megapixel triple rear camera unit, including a 50-megapixel periscope telephoto shooter. It packs a 6,100mAh battery with support for wired as well as wireless fast charging.Xiaomi 15S Pro Price, AvailabilityXiaomi 15S Pro price in China starts at CNY 5,499for the 16GB + 512GB RAM and storage configuration, while the 16GB + 1TB variant costs CNY 5,999. The phone is offered in Dragon Scale Fibre Version and Far Sky Blue finishes. The handset is currently available for purchase in the country via the official e-store. Xiaomi 15S Pro Specifications, FeaturesThe Xiaomi 15S Pro has a 6.73-inch 2KOLED LTPO display with up to 120Hz refresh rate, up to 3,200 nits peak brightness level, a 1,920Hz PWM dimming rate, and Xiaomi's Ceramic Glass 2.0 protection. The screen supports HDR10+ and Dolby Vision as well. The handset is powered by the company's newest 3nm 10-core XRING 01 chipset with an Immortalis-G925 GPU paired with 16GB of LPDDR5X RAM and up to 1TB of UFS 4.0 onboard storage. It ships with Xiaomi's HyperOS 2.0 based on Android 15.For optics, the Xiaomi 15S Pro has a Leica-backed triple rear camera unit including a 50-megapixel 1/ 1.31-inch Light Fusion 900 primary sensor with an f/1.44 aperture and optical image stabilisationsupport. The camera setup also gets a 50-megapixel Samsung S5KJN1 sensor coupled with a 115-degree ultra-wide angle lens with an f/2.2 aperture and macro functionalities, alongside a 50-megapixel Sony IMX858 periscope telephoto shooter with 5x optical zoom, 10x in-sensor lossless zoom, f/2.5 aperture, and OIS support. The smartphone is also equipped with a 32-megapixel OV32B40 front camera with an f/2.0 aperture for selfies and video calls. The Xiaomi 15S Pro packs a 6,100mAh battery with 90W wired and 50W wireless fast charging support. For security, the handset has an in-display fingerprint sensor. Connectivity options include 5G, dual 4G VoLTE, Wi-Fi 7, Bluetooth 5.4, Beidou, Galileo, GLONASS, GPS, NavIC, NFC and a USB Type-C 3.2 Gen 1 port. The phone has an IP68-rated dust and water-resistant build. It also has stereo speakers with Dolby Atmos support. The smartphone measures 161.3×75.3×8.33mm in size and weighs 216g.Affiliate links may be automatically generated - see our ethics statement for details. #xiaomi #15s #pro #with #inhouse

Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Mobile Xiaomi’s XRING 01 Has The Smallest Die Size For Any Current-Generation 3nm Chipset, Barely Beating Apple’s A18 Pro With Its 109mm² Dimensions; Dimensity 9400 The Largest SoC Omar Sohail • May 22, 2025 at 04:57pm EDT The choice to stick with TSMC’s second-generation 3nm process, also known as N3E, for the XRING 01 has allowed Xiaomi to cram in 19 billion transistors while also maintaining a smaller die size, making it an impressive feat when it comes to chip engineering. However, if we compare the latest SoC with the competition that utilize the same lithography, Xiaomi’s latest solution is smaller than the A18 Pro, Dimensity 9400, and the Snapdragon 8 Elite. We now take a closer look at the four chipsets. Apple’s A18 Pro is barely bigger than the XRING 01, measuring 110mm², but sticking with a smaller die is a decent cost-effective strategy A die size comparison was posted by notable content creator Geekerwan, showing that the only SoC larger than the XRING 01 is the Apple A18 Pro, measuring 110mm². The Snapdragon 8 Elite comes in at number three, measuring 124mm², with the Dimensity 9400 being the largest of the four at 126mm². For those wondering why Xiaomi did not proceed to make the XRING 01 slightly larger in dimensions, the reason is primarily related to costs. Increasing the die size will increase the production bill, and seeing as how the XRING 01 will already be manufactured in fewer quantities, Xiaomi likely followed the approach of purposely reducing the die size, but not too much so as to compromise on its performance. A bigger die size will be costly to produce, but it offers a multitude of benefits, such as allowing chipset manufacturers to allocate larger cache sizes and increase performance accordingly. This might be one reason why the XRING 01 relies on a 10-core CPU and a 16-core GPU, as reducing its die size likely meant that Xiaomi would have to introduce compensation elsewhere to offset the potentially lowered performance. Whether the increase in the number of cores will have an adverse effect on the power draw is something that we will touch on in a later topic. For now, take a look at the die size comparison above and let us know in the comments on what you think. News Source: Geekerwan Deal of the Day Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada #xiaomis #xring #has #smallest #die

Xiaomi has unveiled its first in-house flagship chipset, the Xring O1, and it’s got enough power to go head-to-head with Qualcomm’s Snapdragon 8 Elite. The company also unveiled a 15S Pro phone and Pad 7 Ultra tablet that the new chip will power, plus a new version of the Watch S4 powered by another Xiaomi chip.The Xring O1 isn’t Xiaomi’s first phone chipset, but it’s the first since 2017’s midrange Surge S1, and is far more powerful than that. Developed using a second-generation 3nm process, this is a chip intended to rival the 8 Elite, MediaTek’s Dimensity 9400, and Apple’s A18 series. On paper, it looks up to the task.Image: XiaomiXiaomi has opted for a 10-core CPU, more than any of the competition. Two Arm Cortex-X925 prime cores are clocked at 3.9GHz, with four more cores at 3.4GHz, two at 1.9GHz, and another two at 1.8GHz. The 16-core Immortalis-G925 is also top-spec, matching the graphics horsepower in MediaTek’s Dimensity flagship.Chip architecture has started to vary enough between the major players that clock speeds and core counts aren’t a great guide to performance. Neither are lab benchmarks, though Xiaomi’s claimed AnTuTu score of over three million puts this up there with the best, and it’s bullish about the chip’s power-efficiency too.What this tells us, though, is that Xiaomi is serious about the Xring O1 holding its own as a true flagship: it should be in the same ballpark as Android alternatives from Qualcomm and MediaTek, and far ahead of the most powerful chips from Samsung’s Exynos team. To hammer the point home, Xiaomi is launching the Xring O1 inside the 15S Pro, which is essentially a rerelease of last year’s 15 Pro, but with the Snapdragon 8 Elite swapped out for Xiaomi’s own chip. It also comes in a rather sleek carbon fiber design. It’s joined by the Pad 7 Ultra, also using the O1, a premium tablet with a 14-inch OLED screen and large 12,000mAh battery, that at 5.1mm is one of the thinnest tablets on the market.The 15S Pro’s carbon fiber finish is new. Image: XiaomiThe Pad 7 Ultra is a big tablet designed to take on the iPad Pro. Image: XiaomiIt’s clear that Xiaomi’s ambitions go beyond a single chip, and even beyond phones and tablets. To emphasize that, it’s also launched the Xring T1, a flagship chipset designed for smartwatches. Details are light, but it includes a 4G modem, and Xiaomi has used it to power an eSIM version of the Watch S4.All of this sounds like bad news for Qualcomm, which has long counted Xiaomi as a major customer. It’s often the first to announce a phone running the latest Qualcomm flagship each year, and as the third-biggest smartphone manufacturer in the world, Xiaomi is big business for Qualcomm. It will take some comfort in the fact that just this week the two companies signed a multi-year agreement for Xiaomi phones to keep using Qualcomm’s flagship Snapdragon 8-series chips, but there can’t be much doubt that Xiaomi’s long-term plan is to go it alone. After all, if Apple can, why can’t Xiaomi?See More: #xiaomis #first #flagship #phone #chip

Xiaomi is set to unveil the Xring O1 on Thursday, a processor designed for its flagship smartphones. #china039s #xiaomi #commits #billion #inhouse