Qualcomm's next-gen Snapdragon X chips could pack 18 Oryon V3 CPU cores to challenge AMD and Intel
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Rumor mill: Laptops powered by Qualcomm's first-generation Snapdragon X chipsets may have received a somewhat lukewarm response from consumers, but the company has big plans for the PC market this year. The chipmaker's Snapdragon X2 processors will reportedly feature up to 50 percent more CPU cores than their predecessors and employ a new System-in-Package (SiP) configuration whereby the memory and storage will be folded into a single package. According to German tech blog WinFuture, Qualcomm's Snapdragon X2 SoCs will ship with up to 18 Oryon V3 cores, which is 50 percent more than the 12 cores offered by the flagship first-generation Snapdragon X Elite for PCs. The new cores will be more powerful than the current generation, potentially making the chips better at handling both single-threaded and multi-threaded applications.The report adds that the next-generation Snapdragon X chips will employ an SiP design that includes memory and storage in a single package. That means the flagship chip in the lineup will feature 18 CPU cores, 48GB of SK hynix RAM, and a 1TB SSD all folded into one package. The publication believes that the extra cores with additional power and the new SiP configuration will help Qualcomm better compete against AMD and Intel in the high-end PC market.An earlier report from the same publication claimed that Qualcomm was working on a new PC chip codenamed 'SC8480XP' under Project Glymur. It's believed that Qualcomm started testing the SC8480XP in July and August 2024 on platforms fitted with testing housings, enabling rigorous testing without hard soldering 3D NAND and DRAM chips.Other reports suggest that Qualcomm is also looking beyond the laptop segment and planning to target the desktop market with its second-generation Snapdragon X PC chips. According to WinFuture's Roland Quandt, the company is testing the SC8480XP chip with an AIO liquid cooler, suggesting that it is designed for desktop PCs.A recent leak via a shipping manifest further revealed that Qualcomm could market its second-generation Snapdragon X PC chips under the 'Ultra Premium' moniker. However, it's unclear whether they will also retain the 'Elite' branding or if the company has decided to ditch the name. // Related Stories
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