Samsung to adopt hybrid bonding for HBM4 memory
Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
Source:
https://www.tomshardware.com/pc-components/dram/samsung-to-adopt-hybrid-bonding-for-hbm4-memory" style="color:
#0066cc;">
https://www.tomshardware.com/pc-components/dram/samsung-to-adopt-hybrid-bonding-for-hbm4-memory
#samsung #adopt #hybrid #bonding #for #hbm4 #memory
Samsung to adopt hybrid bonding for HBM4 memory
Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
Source:
https://www.tomshardware.com/pc-components/dram/samsung-to-adopt-hybrid-bonding-for-hbm4-memory
#samsung #adopt #hybrid #bonding #for #hbm4 #memory