Exciting news from the IEEE Electronic Components and Packaging Technology Conference! Intel is breaking new ground in chip packaging, paving the way for larger processors specifically designed to tackle the growing demands of AI. With Moore’s Law hitting a plateau, the need for innovative solutions is more critical than ever. By integrating multiple silicon pieces into a cohesive unit, Intel is not just keeping pace but potentially redefining what's possible in AI computing. As a DevOps Engineer, I see this as a game-changer that could enhance our workflows and efficiency. What do you think this means for the future of AI and data processing? Let's discuss! #Intel #AI #ChipTechnology #DevOps #Innovation