In case you haven't checked out Archinect's Pinterest boards in a while, we have compiled ten recently pinned images from outstanding projects on various Archinect Firm and People profiles.Today's top imagesare from the board Glass. Tip: Use the handy FOLLOW feature to easily keep up-to-date with all your favorite Archinect profiles. ↑ Glorya Kaufman Performing Arts Center in Los Angeles, CA by AUX Architecture; Photo: Nic Lehoux ↑ Raffles City Beijing in Beijing, China by CLOU architects ↑ Amirá in Querétaro, Mexico by Archetonic; Photo: Rafael Gamo ↑ Ishida Tokyo Regional Headquarters in Tokyo, Japan by NIKKEN SEKKEI; Photo: Ken’ichi Suzuki ↑ Poetry Anthology of Light in Guangzhou, China by PMA STUDIO; Photo: Jason Xie ↑ RLJ Chapel in San Juan Cosalá, Mexico by Ricardo Yslas Gámez Arquitectos; Photo: Jaime Navarro Soto ↑ Mountain Villa in Huizhou, China by BDSD Boundless Design; Photo: Hanmo Vision Yi Gao ↑ PLP City Range mixed-use in Bangkok, Thailand by... #examples #glass #architecture #liked #this

Samsung Electronics is taking a major step in the right direction in semiconductor innovation by planning to adopt glass substrate in chip packaging starting in 2028. If you are not familiar, the transition marks a major shift from silicon-based interposers to glass interposers, and it is the first time the company has laid out an official roadmap for the evolution, according to ETNews. Samsung’s glass interposers could revolutionize AI chip packaging by offering better performance, lower costs, and faster production In chip manufacturing, interposers are a key component in 2.5D chip packaging, especially for AI semiconductors, where the GPUs are surrounded by high-bandwidth memory or HBM. The interposers are responsible for connecting the two components, allowing for faster communication. While the traditional interposers are effective, they are quite expensive considering how the AI industry is on the rise. In comparison, the glass interposers are cheaper, but feature more precision for ultra-fine circuits and improved dimensional stability. The benefits of the glass interposers definitely overtake the traditional interposers, which makes them a perfect option for next-gen AI chips. An industry official noted that “Samsung has established a plan to transition from silicon interposers to glass interposers in 2028 to meet customer demands.” The notion is in line with similar plans from competitors like AMD, which shows a surge in industry shift toward the new semiconductor technology. While the industry is gradually embarking on the glass substrate bandwagon for interposers, Samsung's rendition of the technology is different, as it is developing sub-100x100mm glass units to speed up the prototyping instead of using large glass panels with a size of 510x515mm. Even though the smaller size could hurt the efficiency, it will allow the company to enter the market much faster. Samsung is also utilizing its Cheonan campus panel-level packaging or PLP line, which makes use of square panels instead of round wafers. Overall, this will allow the company to sit in a much better position than the competition in the AI industry. Furthermore, the move also complements the company's AI Integrated Solution strategy, which would bring the foundry services, HBM memory, and advanced packaging under one umbrella. With the AI industry booming rapidly, Samsung's transition to a glass substrate for interposers could give it an edge over the competition in the long run. Since the technology is going to improve gradually, the company could also benefit from external orders, which would allow it to increase its revenue. We will keep a close eye on the transition, so be sure to stick around for more details. Deal of the Day #samsung #replace #silicon #with #glass

In case you haven't checked out Archinect's Pinterest boards in a while, we have compiled ten recently pinned images from outstanding projects on various Archinect Firm and People profiles. Today's top imagesare from the board Details. Tip: use the handy FOLLOW feature to easily keep up-to-date with all your favorite Archinect profiles. ↑ Yunomi in Los Angeles, CA by Design Opera Architects; Photo: Taiyo Watanabe ↑ Deer Harbor in Eastsound, WA by Prentiss + Balance + Wickline Architects; Photo: Andrew Pogue Photography ↑ Grass House in Washington, DC by BLDUS; Photo: Ty Cole ↑ The Crown Coffee Laboratory in Oakland, CA by Studio Terpeluk; Photo: Joe Fletcher ↑ Pine Cove in Harpswell Center, ME by Woodhull ↑ Whidbey Uparati in Whidbey Island, WA by Wittman Estes; Photo: Andrew Pogue ↑ Ningbo Apartment in Ningbo, China by Increments Studio ↑ Villa Sidonius in Prague, Czech Republic by Stempel & Tesar architekti; Photo: Filip Šlapal ↑ PLP City Range mixed-use ... #architectural #details #that #stood #out

Scheme would be Elizabeth House developer’s first foray into sector Early sketch of PLP’s plan for the site HB Reavis has appointed PLP to overhaul a six-storey office building in London and turn it into student accommodation. The Slovakian-based developer behind JRA’s Bloom Clerkenwell office building in Farringdon is looking to revamp 10 Leake Street into new homes for students. The developer said it would be its first foray into the sector, having last year completed its most recent development an office scheme called Worship Square, situated between Old Street and Shoreditch and designed by Make. How the 10 Leake Street site currently looks The building at 10 Leake Street is close to Waterloo train station with HB Reavis promising it will offer a mix of studios and shared accommodation. The firm held its first public consultation on the plans last weekend with another event slated for tomorrow (Wednesday). A second round of consultation is due next month with proposals due to be sent in to Lambeth planners later in the summer. Others working on the development include planning consultant DP9. HB Reavis is the developer behind the planned makeover of the 1960s-built Elizabeth House, which is next door to Waterloo station. It has been renamed One Waterloo and designed by AHMM with plans including 112,000 sq m of office space and close to 10,000 sq m of retail space. AHMM’s proposals were first drawn up in 2018 after HB Reavis bought the site the year before with AHMM’s scheme, which replaced an earlier proposal by David Chipperfield, first given planning in October 2019. But the scheme has been stalled since it was given final sign-off in 2021. Source: https://www.bdonline.co.uk/news/plp-picked-to-turn-rundown-waterloo-office-block-into-student-homes/5135944.article #plp #picked #turn #rundown #waterloo #office #block #into #student #homes