Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech MobileSemiconductor TSMC Plans To Commence 1.4nm Wafer Production In 2028, With The Advanced Lithography Delivering As Much As Up To 30 Percent Performance And Efficiency Improvements Omar Sohail • Apr 24, 2025 at 12:18am EDT The 2nm race is currently being led by TSMC because at the start of the month, the foundry giant reportedly started accepting orders for its cutting-edge wafers, with Apple likely being the first recipient of this technology. It will take a few years for the Taiwanese semiconductor behemoth to transition to the more advanced node, but we should start seeing 1.4nm chips in the distant future, as the company has said that it will kick off production for the latter in 2028. Naturally, there will be significant benefits to transitioning to this manufacturing process, so let us jump into the details immediately. New process to make 1.4nm chips is called A14 or 14-Angstrom node, and is specifically designed for sub-2nm technology The announcement was made during TSMC’s North America Technology Symposium in Santa Clara, California, with the firm’s CEO C.C. Wei stating that ‘our customers’ are constantly looking into the future. In its quest to develop ‘start of the art’ wafers for a multitude of customers, TSMC’s only rival in this space is Samsung. However, we recently reported that the Korean giant had cancelled its own version of 1.4nm for undisclosed reasons. On the plus side, the company was later reported to have established a team laser-focused on 1nm chip development, with a mass production target set for 2029. Assuming Samsung sticks to its intended timeline, it can provide some competition to TSMC, leading to negotiable prices for this technology, but for the time being, the focus is likely on increasing those 2nm yields. As for the benefits of customers placing 1.4nm wafers orders, Nikkei Asia reports that the A14 node can deliver 15 percent improved performance and a 30 percent reduction in power consumption. There is currently no information regarding which client hinted at being the first to place orders for these 1.4nm chips, but we have a hunch that Apple’s close business relationship with TSMC and its ability to procure massive wafer shipments will make the deal between the two a major priority. Aside from introducing its A14 technology in 2028, TSMC also mentioned that it will introduce next-generation packaging technology that combines a bevy of chips with different functions into a single package, with production expected to begin in 2027. News Source: Nikkei Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada