Enfin ! Pixar profite du SIGGRAPH pour dévoiler RenderMan 27, nouvelle version de son moteur de rendu. La version 27 apporte en particulier une avancée majeure : le système de rendu XPU, qui permet de faire du rendu à la fois sur CPU et GPU, est déso

Découvrez VQVDB, un outil open source de compression pour les données volumétriques stockées en OpenVDB. Il s’appuie sur le machine learning pour parvenir à une compression qui peut aller jusqu’à x32. L’outil est accéléré par GPU, v

Building a simple 8-bit computer is a great way to understand computing fundamentals, but there’s only so much you can learn by building a system around an existing processor. If …read more

[Sylvain Fortin] recently wrote in to tell us about his Homebrew CPU Project, and the story behind this one is truly remarkable. He began working on this toy CPU back …read more

Reasonable GPU performance is hampered by poor CPU performance.

This week, Hackaday’s Elliot Williams and Al Williams caught up after a week-long hiatus. There was a lot to talk about, including clocks, DIY USB cables, and more. In Hackaday …read more

Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Apple’s A20 Rumored To Be Exclusive To The iPhone 18 Pro, iPhone 18 Pro Max And The Company’s Foldable Flagship, Will Leverage TSMC’s Advanced 2nm Process Combined With The Newer WMCM Packaging Omar Sohail • Jun 16, 2025 at 02:00am EDT TSMC might have started accepting orders for its 2nm wafers, but the first chipsets fabricated on this cutting-edge lithography are not expected to arrive until late next year. As the majority of you are well aware, Apple likely pounced on the opportunity to be the first recipient of this technology, with its A20 rumored to be mass produced on the 2nm process. However, the same rumor claims that the Cupertino firm will employ the foundry giant’s WMCM (Wafer-Level Multi-Chip Module) packaging, bringing in more benefits, but customers can only experience these if they intend on making the iPhone 18 Pro, iPhone 18 Pro Max, or Apple’s upcoming foldable flagship their daily driver. The latest rumor also claims that Apple will not be upping the RAM count on any iPhone model that will ship with the A20 The efforts to bring WMCM packaging to the A20 will be highly beneficial for Apple because it will allow the latter to maintain the chipset’s footprint while having immense flexibility in combining different components. In short, multiple dies such as the CPU, GPU, memory, and other parts can be integrated at a wafer level, before being sliced into individual chips. This approach will help Apple to mass manufacture smaller chipsets that are considerably power-efficient, but also powerful at the same time, leading to an incredible ‘performance per watt’ metric. China Times reports that this A20 upgrade will arrive for the iPhone 18 Pro, the iPhone 18 Pro Max, and Apple’s foldable flagship, which the rumor refers to as the iPhone 18 Fold. TSMC’s production line specifically for WMCM chipsets will be located in Chiayi AP7, with an estimated monthly production capacity of 50,000 pieces by the end of 2026. Interestingly, the RAM count will not change from this year, with Apple said to retain the 12GB limit. We have reported about the iPhone 18 series shifting to TSMC’s WMCM packaging before, while also talking about a separate rumor claiming that the A20 will be 15 percent faster than the A19 at the same power draw. The rumor does not mention whether the less expensive iPhone 18 models will be treated to chipsets featuring WMCM packaging, or if Apple intends to save on design and production costs by sticking with the older Integrated Fan-Out (InFo) packaging. All of these answers will be provided in the fourth quarter of 2026, when the iPhone 18 family goes official, so stay tuned. News Source: China Times Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada

In this video, Louis du Mont (@ldm) shows how to animate objects using Geometry Node, unlocking quick control and variation which scales. ⇨ Robotic Planet: https://cgboost.link/robotic-planet-449836 ⇨ Project Files: https://www.cgboost.com/resources CHAPTERS 00:00 - Intro 00:33 - Joining Objects 04:01 - Ambient Ship Motion 09:04 - Ambient Laser Motion 11:06 - Disc Rotation 12:26 - Using Group Inputs 15:02 - Outro MY SYSTEM CPU: Ryzen 5900x GPU: GeForce RTX 3090 RAM: 96 GB FOLLOW CG BOOST ⇨ X: https://twitter.com/cgboost ⇨ Instagram: https://www.instagram.com/cg_boost/ ⇨ Web: https://cgboost.com/

Cases News 6 Years to Make a Fan, G370A Budget Case, & Phanteks Technical Fan Discussion, ft. CTOJune 9, 2025Last Updated: 2025-06-09We cover Phanteks’ new G370A budget case, the XT M3, and the Evolv X2 MatrixThe HighlightsPhanteks’ new X2 Matrix case has 900 LEDs and is aiming to be around $200Phanteks’ G370A is a $60 case that includes 3x120mm fansThe company has a new T30-140 fan that required 6 years of engineering to makeTable of ContentsAutoTOC Grab a GN Tear-Down Toolkit to support our AD-FREE reviews and IN-DEPTH testing while also getting a high-quality, highly portable 10-piece toolkit that was custom designed for use with video cards for repasting and water block installation. Includes a portable roll bag, hook hangers for pegboards, a storage compartment, and instructional GPU disassembly cards.IntroWe visited Phanteks’ suite at Computex 2025 and the company showed off several cases along with a fan that took the company roughly 6 years to make.Editor's note: This was originally published on May 21, 2025 as a video. This content has been adapted to written format for this article and is unchanged from the original publication.CreditsHostSteve BurkeCamera, Video EditingMike GaglioneVitalii MakhnovetsWriting, Web EditingJimmy ThangPhanteks Matrix CasesWe’ve talked about Phanteks’ X2 case in the past but the company was showing off its new Matrix version, which has matrix LEDs. The X2 Matrix has 900 LEDs in a 10x90 layout. It’s supposed to be about $30 to $40 more expensive than the base X2, which means it should end up around $200.  The interesting thing about the case is that the LEDs wrap around the chassis. In terms of communication, the LEDs connect to the motherboard via USB 2.0 and use SATA for power. This allows Phanteks to bypass a WinRing 0 type situation. Another Matrix case had 600 of them in a 10x60 LED configuration and is supposed to be about $120. Phanteks also has software that allows you to reconfigure what the LEDs display. When we got to the company’s suite, it had been programmed to say, “Gamers Nexus here,” which was cool to see. We also saw that the LEDs can also be used to highlight CPU temperature. Phanteks G370A Grab a GN15 Large Anti-Static Modmat to celebrate our 15th Anniversary and for a high-quality PC building work surface. The Modmat features useful PC building diagrams and is anti-static conductive. Purchases directly fund our work! (or consider a direct donation or a Patreon contribution!)Phanteks also showed off its G370A case, which is a $60 case that includes 3x120mm fans in the front coupled with a mesh front that offers 38% hole porosity. The company tells us that manufacturing typically offers around 25% porosity.  It has a glass side panel and the back side panel of the case is just steel and has no ventilation. Taking a look at the placement of the front fans, we asked Phanteks why they weren’t higher on the case so the bottom fan could get more exposure to the bottom power supply shroud area and the answer the company gave us was simply clearance for a 360mm radiator at the top. There’s not a lot of room for the air coming into the shroud. Some of it will go through the cable pass-through if it’s empty. The back of the case features a drive mount.XTM3The company also showed off a Micro ATX case called the XTM3. It comes with 3 fans and is $70. For its front panel, it has a unique punch out for its fans. The top panel is part standard ventilation but it does have one side that provides less airflow, which covers where the PSU would exhaust out of. The side panel does have punch-outs for the PSU, however. We don’t test power supplies, though that may change in the future. Power supplies can take a lot of thermal abuse, however, so we’re not super concerned here.  The case should be shipping in the next month or so and is 39.5 liters, which includes the feet. We appreciate that as not a lot of companies will factor that in. There’s also a lot of cable management depth on the back and the case also supports BTF. In addition, there’s a panel that clamps down all of the power supply cables. T30 FanPhanteks’ T30 fan took the company 6 years to make and is a 140mm fan. The company is competing with Noctua in the high-end fan space, but is going for a grey theme instead of brown. Phanteks CTO Tenzin Rongen Interview Visit our Patreon page to contribute a few dollars toward this website's operation (or consider a direct donation or buying something from our GN Store!) Additionally, when you purchase through links to retailers on our site, we may earn a small affiliate commission.Finally, we interviewed Phanteks CTO Tenzin Rongen to discuss technical details behind the company’s long-developed fans. Make sure to check it out in our video.