¿El nuevo "franc TSMC en América" será la nueva dirección para la industria de semiconductores? Parece que hay algo de interés, pero la verdad es que no hay mucho entusiasmo por aquí. La idea de que TSMC se expanda a América suena bien en papel, pero, ¿realmente cambiará algo? Puede que algunos lo vean como una oportunidad, pero otros simplemente están... bueno, aburridos. En fin, veremos qué pasa. #semiconductores #TSMC #industria #tecnología #América

Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Apple’s A20 Rumored To Be Exclusive To The iPhone 18 Pro, iPhone 18 Pro Max And The Company’s Foldable Flagship, Will Leverage TSMC’s Advanced 2nm Process Combined With The Newer WMCM Packaging Omar Sohail • Jun 16, 2025 at 02:00am EDT TSMC might have started accepting orders for its 2nm wafers, but the first chipsets fabricated on this cutting-edge lithography are not expected to arrive until late next year. As the majority of you are well aware, Apple likely pounced on the opportunity to be the first recipient of this technology, with its A20 rumored to be mass produced on the 2nm process. However, the same rumor claims that the Cupertino firm will employ the foundry giant’s WMCMpackaging, bringing in more benefits, but customers can only experience these if they intend on making the iPhone 18 Pro, iPhone 18 Pro Max, or Apple’s upcoming foldable flagship their daily driver. The latest rumor also claims that Apple will not be upping the RAM count on any iPhone model that will ship with the A20 The efforts to bring WMCM packaging to the A20 will be highly beneficial for Apple because it will allow the latter to maintain the chipset’s footprint while having immense flexibility in combining different components. In short, multiple dies such as the CPU, GPU, memory, and other parts can be integrated at a wafer level, before being sliced into individual chips. This approach will help Apple to mass manufacture smaller chipsets that are considerably power-efficient, but also powerful at the same time, leading to an incredible ‘performance per watt’ metric. China Times reports that this A20 upgrade will arrive for the iPhone 18 Pro, the iPhone 18 Pro Max, and Apple’s foldable flagship, which the rumor refers to as the iPhone 18 Fold. TSMC’s production line specifically for WMCM chipsets will be located in Chiayi AP7, with an estimated monthly production capacity of 50,000 pieces by the end of 2026. Interestingly, the RAM count will not change from this year, with Apple said to retain the 12GB limit. We have reported about the iPhone 18 series shifting to TSMC’s WMCM packaging before, while also talking about a separate rumor claiming that the A20 will be 15 percent faster than the A19 at the same power draw. The rumor does not mention whether the less expensive iPhone 18 models will be treated to chipsets featuring WMCM packaging, or if Apple intends to save on design and production costs by sticking with the older Integrated Fan-Outpackaging. All of these answers will be provided in the fourth quarter of 2026, when the iPhone 18 family goes official, so stay tuned. News Source: China Times Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada #apples #a20 #rumored #exclusive #iphone

Rumors strongly suggest that Apple will be overhauling the MacBook Pro in 2026, marking five years since the previous redesign that we know and love today. There are three key rumors to follow with this redesigned MacBook Pro, and we’ll be delving into them here. OLED display After debuting in the iPad Pro in 2024, Apple is expected to introduce OLED display technology to the MacBook Pro for the very first time with the redesign in 2026. This’ll provide higher brightness, better contrast ratios, and nicer colors to the MacBook Pro lineup for the very first time. Plus, according to TheElec, Apple will be using the same Tandem OLED display tech as the aforementioned iPad Pro: The OLED MacBook Air is also expected to get a standard single-stack display, rather than the more sophisticated Two-Stack Tandem displays we reported on for the MacBook Pro. Single-stack displays have one red, green and blue layer, while two-stack tandem OLED has a second RGB layer. Two layers stacked in tandem increases the brightness of the screen, while also increasing longevity. While transitioning to OLED, Apple may also ditch the notch, in favor of a smaller camera hole cutout. This information comes from Omdia, who describes it as a “rounded corner + hole cut.” The report doesn’t specify whether or not it’ll be a single hole punch, or something more similar to Dynamic Island on the iPhone. Either way, there won’t be as chunky of a cutout in your MacBook Pro display once the redesign arrives. Thinner design According to Bloomberg, Apple will be adopting a new, thinner design with the 2026 MacBook Pro. There aren’t many other details specified, so it’s unclear if the overall chassis design will change: Though Apple has continued to enhance the product with new chips and other internal improvements, the MacBook Pro probably won’t get another true overhaul until 2026. The company had once hoped to release this new version in 2025 — with a thinner design and a move to crisper OLED screens — but there were delays related to the display technology. Cutting-edge M6 chip Apple will also debut the M6 family of chips in this new MacBook Pro redesign. Currently, M6 is anticipated to be the first generation of Apple Silicon to adopt TSMC’s 2nm technology, alongside the A20 chip for iPhone. As per usual, we should see M6, M6 Pro, and M6 Max versions of the MacBook Pro, in both 14-inch and 16-inch sizes. With a new process node, we should see noticeable performance and efficiency gains. Wrap up Overall, the biggest feature of this upgrade is certainly the fact that the MacBook Pro will be adopting OLED. That said, I’ll certainly appreciate the thinner design – particularly on the 16-inch MacBook Pro, which currently comes in at 4.7 pounds. In case you aren’t too fond of waiting around a year and a half to buy a new MacBook Pro, there are some good discounts on the current M4 MacBook Pro models now that they’re around halfway through their lifespan. You can pick up an M4 14-inch for an M4 Pro 14-inch for or an M4 Pro 16-inch for These are all around off compared to their typical prices. My favorite Apple accessory recommendations: Follow Michael: X/Twitter, Bluesky, Instagram Add 9to5Mac to your Google News feed.  FTC: We use income earning auto affiliate links. More.You’re reading 9to5Mac — experts who break news about Apple and its surrounding ecosystem, day after day. Be sure to check out our homepage for all the latest news, and follow 9to5Mac on Twitter, Facebook, and LinkedIn to stay in the loop. Don’t know where to start? Check out our exclusive stories, reviews, how-tos, and subscribe to our YouTube channel #apple #reportedly #redesigning #macbook #pro

Menu Home News Hardware Gaming Mobile Finance Deals Reviews How To Wccftech Xiaomi Cannot Develop A Future In-House XRING Chipset Using TSMC’s 2nm Process Because Of The U.S. Crackdown On Specialized EDA Tools, Company Will Be Limited To The ‘N3E’ Node Omar Sohail • Jun 5, 2025 at 04:28am EDT The XRING 01 is a technological milestone, not just for Xiaomi, but it is also regarded as an achievement for China, and one that would make the U.S. government very nervous, because, like current-generation chipsets, the in-house solution has been mass produced on TSMC’s 3nm ‘N3E’ process. Unfortunately, Xiaomi’s progress might not scale past this threshold because the Trump administration has banned the export of EDA tools that are necessary to successfully fabricate a 2nm SoC. Tipster claims that EDA tools are mandatory in designing GAAFET structures, meaning that Xiaomi and its XRING division will be limited to TSMC’s ‘N3E’ node Since TSMC’s 2nm technology has a GAAFET structure, Weibo tipster Digital Chat Station states that it is imperative that Xiaomi gets hold of those EDA, or Electronic Design Automation tools. The Taiwanese semiconductor giant was reported to have begun accepting orders for 2nm wafers from April 1, with each unit estimated to cost Among the regular trio of Apple, Qualcomm, and MediaTek, Xiaomi would count itself as one of TSMC’s customers. Sadly, with the recent development, the Chinese firm will be limited to the 3nm N3E node, facing a similar fate to Huawei. The latest claim also suggests that to possess the latest and greatest hardware in smartphone chipset technology, Xiaomi will have little choice but to continue relying on Qualcomm and MediaTek, which will unveil the Snapdragon 8 Elite Gen 2 and Dimensity 9500 later this year. Fortunately, restricting exports of cutting-edge machinery to China will only boost its resolve to continue the production of local EDA tools, but will this hardware be developed fast enough for the Xiaomi XRING 02 to be fabricated on TSMC’s 2nm process? We will have the answer to this question in the future. Readers should note that there is also the risk that the Trump administration enforces a massive ban on Xiaomi, preventing the latter from doing business with TSMC or Samsung in any way, shape, or form. While China is pursuing the manufacturing of custom EUV machinery to eliminate any overseas trade involvement, it may take several years for the country to achieve autonomy. News Source: Digital Chat Station Subscribe to get an everyday digest of the latest technology news in your inbox Follow us on Topics Sections Company Some posts on wccftech.com may contain affiliate links. We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for sites to earn advertising fees by advertising and linking to amazon.com © 2025 WCCF TECH INC. 700 - 401 West Georgia Street, Vancouver, BC, Canada #xiaomi #cannot #develop #future #inhouse

In context: TSMC has steadily raised the prices of its most advanced semiconductor process nodes over the past several years – so much so that one analysis suggests the cost per transistor hasn't decreased in over a decade. Further price hikes, driven by tariffs and rising development costs, are reinforcing the notion that Moore's Law is truly dead. The Commercial Times reports that TSMC's upcoming N2 2nm semiconductors will cost per wafer, a roughly 66% increase over the company's 3nm chips. Future nodes are expected to be even more expensive and likely reserved for the largest manufacturers. TSMC has justified these price increases by citing the massive cost of building 2nm fabrication plants, which can reach up to million. According to United Daily News, major players such as Apple, AMD, Qualcomm, Broadcom, and Nvidia are expected to place orders before the end of the year despite the higher prices, potentially bringing TSMC's 2nm Arizona fab to full capacity. Also see: How profitable are TSMC's nodes: crunching the numbers Unsurprisingly, Apple is getting first dibs. The A20 processor in next year's iPhone 18 Pro is expected to be the first chip based on TSMC's N2 process. Intel's Nova Lake processors, targeting desktops and possibly high-end laptops, are also slated to use N2 and are expected to launch next year. Earlier reports indicated that yield rates for TSMC's 2nm process reached 60% last year and have since improved. New data suggests that 256Mb SRAM yield rates now exceed 90%. Trial production is likely already underway, with mass production scheduled to begin later this year. // Related Stories With tape-outs for 2nm-based designs surpassing previous nodes at the same development stage, TSMC aims to produce tens of thousands of wafers by the end of 2025. TSMC also plans to follow N2 with N2P and N2X in the second half of next year. N2P is expected to offer an 18% performance boost over N3E at the same power level and 36% greater energy efficiency at the same speed, along with significantly higher logic density. N2X, slated for mass production in 2027, will increase maximum clock frequencies by 10%. As semiconductor geometries continue to shrink, power leakage becomes a major concern. TSMC's 2nm nodes will address this issue with gate-all-aroundtransistor architectures, enabling more precise control of electrical currents. Beyond 2nm lies the Angstrom era, where TSMC will implement backside power delivery to further enhance performance. Future process nodes like A16and A14could cost up to per wafer. Meanwhile, Intel is aiming to outpace TSMC's roadmap. The company recently began risk production of its A18 node, which also features gate-all-around and backside power delivery. These chips are expected to debut later this year in Intel's upcoming laptop CPUs, codenamed Panther Lake. #tsmc039s #2nm #wafer #prices #hit