• Samsung To Replace Silicon With Glass Interposers By 2028, Aiming For Faster AI Chips, Cheaper Manufacturing, And An Edge In Semiconductor Innovation

    Samsung Electronics is taking a major step in the right direction in semiconductor innovation by planning to adopt glass substrate in chip packaging starting in 2028. If you are not familiar, the transition marks a major shift from silicon-based interposers to glass interposers, and it is the first time the company has laid out an official roadmap for the evolution, according to ETNews.
    Samsung’s glass interposers could revolutionize AI chip packaging by offering better performance, lower costs, and faster production
    In chip manufacturing, interposers are a key component in 2.5D chip packaging, especially for AI semiconductors, where the GPUs are surrounded by high-bandwidth memory or HBM. The interposers are responsible for connecting the two components, allowing for faster communication. While the traditional interposers are effective, they are quite expensive considering how the AI industry is on the rise. In comparison, the glass interposers are cheaper, but feature more precision for ultra-fine circuits and improved dimensional stability.
    The benefits of the glass interposers definitely overtake the traditional interposers, which makes them a perfect option for next-gen AI chips. An industry official noted that “Samsung has established a plan to transition from silicon interposers to glass interposers in 2028 to meet customer demands.” The notion is in line with similar plans from competitors like AMD, which shows a surge in industry shift toward the new semiconductor technology.
    While the industry is gradually embarking on the glass substrate bandwagon for interposers, Samsung's rendition of the technology is different, as it is developing sub-100x100mm glass units to speed up the prototyping instead of using large glass panels with a size of 510x515mm. Even though the smaller size could hurt the efficiency, it will allow the company to enter the market much faster.
    Samsung is also utilizing its Cheonan campus panel-level packaging or PLP line, which makes use of square panels instead of round wafers. Overall, this will allow the company to sit in a much better position than the competition in the AI industry. Furthermore, the move also complements the company's AI Integrated Solution strategy, which would bring the foundry services, HBM memory, and advanced packaging under one umbrella.
    With the AI industry booming rapidly, Samsung's transition to a glass substrate for interposers could give it an edge over the competition in the long run. Since the technology is going to improve gradually, the company could also benefit from external orders, which would allow it to increase its revenue. We will keep a close eye on the transition, so be sure to stick around for more details.

    Deal of the Day
    #samsung #replace #silicon #with #glass
    Samsung To Replace Silicon With Glass Interposers By 2028, Aiming For Faster AI Chips, Cheaper Manufacturing, And An Edge In Semiconductor Innovation
    Samsung Electronics is taking a major step in the right direction in semiconductor innovation by planning to adopt glass substrate in chip packaging starting in 2028. If you are not familiar, the transition marks a major shift from silicon-based interposers to glass interposers, and it is the first time the company has laid out an official roadmap for the evolution, according to ETNews. Samsung’s glass interposers could revolutionize AI chip packaging by offering better performance, lower costs, and faster production In chip manufacturing, interposers are a key component in 2.5D chip packaging, especially for AI semiconductors, where the GPUs are surrounded by high-bandwidth memory or HBM. The interposers are responsible for connecting the two components, allowing for faster communication. While the traditional interposers are effective, they are quite expensive considering how the AI industry is on the rise. In comparison, the glass interposers are cheaper, but feature more precision for ultra-fine circuits and improved dimensional stability. The benefits of the glass interposers definitely overtake the traditional interposers, which makes them a perfect option for next-gen AI chips. An industry official noted that “Samsung has established a plan to transition from silicon interposers to glass interposers in 2028 to meet customer demands.” The notion is in line with similar plans from competitors like AMD, which shows a surge in industry shift toward the new semiconductor technology. While the industry is gradually embarking on the glass substrate bandwagon for interposers, Samsung's rendition of the technology is different, as it is developing sub-100x100mm glass units to speed up the prototyping instead of using large glass panels with a size of 510x515mm. Even though the smaller size could hurt the efficiency, it will allow the company to enter the market much faster. Samsung is also utilizing its Cheonan campus panel-level packaging or PLP line, which makes use of square panels instead of round wafers. Overall, this will allow the company to sit in a much better position than the competition in the AI industry. Furthermore, the move also complements the company's AI Integrated Solution strategy, which would bring the foundry services, HBM memory, and advanced packaging under one umbrella. With the AI industry booming rapidly, Samsung's transition to a glass substrate for interposers could give it an edge over the competition in the long run. Since the technology is going to improve gradually, the company could also benefit from external orders, which would allow it to increase its revenue. We will keep a close eye on the transition, so be sure to stick around for more details. Deal of the Day #samsung #replace #silicon #with #glass
    WCCFTECH.COM
    Samsung To Replace Silicon With Glass Interposers By 2028, Aiming For Faster AI Chips, Cheaper Manufacturing, And An Edge In Semiconductor Innovation
    Samsung Electronics is taking a major step in the right direction in semiconductor innovation by planning to adopt glass substrate in chip packaging starting in 2028. If you are not familiar, the transition marks a major shift from silicon-based interposers to glass interposers, and it is the first time the company has laid out an official roadmap for the evolution, according to ETNews. Samsung’s glass interposers could revolutionize AI chip packaging by offering better performance, lower costs, and faster production In chip manufacturing, interposers are a key component in 2.5D chip packaging, especially for AI semiconductors, where the GPUs are surrounded by high-bandwidth memory or HBM. The interposers are responsible for connecting the two components, allowing for faster communication. While the traditional interposers are effective, they are quite expensive considering how the AI industry is on the rise. In comparison, the glass interposers are cheaper, but feature more precision for ultra-fine circuits and improved dimensional stability. The benefits of the glass interposers definitely overtake the traditional interposers, which makes them a perfect option for next-gen AI chips. An industry official noted that “Samsung has established a plan to transition from silicon interposers to glass interposers in 2028 to meet customer demands.” The notion is in line with similar plans from competitors like AMD, which shows a surge in industry shift toward the new semiconductor technology. While the industry is gradually embarking on the glass substrate bandwagon for interposers, Samsung's rendition of the technology is different, as it is developing sub-100x100mm glass units to speed up the prototyping instead of using large glass panels with a size of 510x515mm. Even though the smaller size could hurt the efficiency, it will allow the company to enter the market much faster. Samsung is also utilizing its Cheonan campus panel-level packaging or PLP line, which makes use of square panels instead of round wafers. Overall, this will allow the company to sit in a much better position than the competition in the AI industry. Furthermore, the move also complements the company's AI Integrated Solution strategy, which would bring the foundry services, HBM memory, and advanced packaging under one umbrella. With the AI industry booming rapidly, Samsung's transition to a glass substrate for interposers could give it an edge over the competition in the long run. Since the technology is going to improve gradually, the company could also benefit from external orders, which would allow it to increase its revenue. We will keep a close eye on the transition, so be sure to stick around for more details. Deal of the Day
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  • Substrate Material Refraction Help

    Hello I’m trying to get substrate refraction to work, so far it’s going well and it’s working the only issue I’m having I can’t get zero refraction. If you have a black and white mask and you want refraction only in the white parts how can I zero refraction wherever there’s black in the mask? For me it’s leaving behind a very subtle dark tint
    What I’ve done is, I have a Substrate Slab BSDF - Simple. In Roughness I have 0, in SSS MFP I have 1, in Normal I have a Normal map, in Refraction I have a Lerp A is 1, B is 0 and Alpha is a mask texture. However there’s a subtle very subtle black tint where the black of the mask is in, I don’t know how to completely remove that dark tint, it’s very subtle but it’s visible nonetheless.
    #substrate #material #refraction #help
    Substrate Material Refraction Help
    Hello I’m trying to get substrate refraction to work, so far it’s going well and it’s working the only issue I’m having I can’t get zero refraction. If you have a black and white mask and you want refraction only in the white parts how can I zero refraction wherever there’s black in the mask? For me it’s leaving behind a very subtle dark tint What I’ve done is, I have a Substrate Slab BSDF - Simple. In Roughness I have 0, in SSS MFP I have 1, in Normal I have a Normal map, in Refraction I have a Lerp A is 1, B is 0 and Alpha is a mask texture. However there’s a subtle very subtle black tint where the black of the mask is in, I don’t know how to completely remove that dark tint, it’s very subtle but it’s visible nonetheless. #substrate #material #refraction #help
    REALTIMEVFX.COM
    Substrate Material Refraction Help
    Hello I’m trying to get substrate refraction to work, so far it’s going well and it’s working the only issue I’m having I can’t get zero refraction. If you have a black and white mask and you want refraction only in the white parts how can I zero refraction wherever there’s black in the mask? For me it’s leaving behind a very subtle dark tint What I’ve done is, I have a Substrate Slab BSDF - Simple. In Roughness I have 0, in SSS MFP I have 1, in Normal I have a Normal map, in Refraction I have a Lerp A is 1, B is 0 and Alpha is a mask texture. However there’s a subtle very subtle black tint where the black of the mask is in, I don’t know how to completely remove that dark tint, it’s very subtle but it’s visible nonetheless.
    0 Comentários 0 Compartilhamentos 0 Anterior
  • Mapping the Expanding Role of 3D Printing in Micro and Nano Device Fabrication

    A new review by researchers from the Beijing University of Posts and Telecommunications, CETC 54, Sun Yat-sen University, Shenzhen University, and the University of Electronic Science and Technology of China surveys the latest developments in 3D printing for microelectronic and microfluidic applications. The paper released on Springer Nature Link highlights how additive manufacturing methods have reached sub-micron precision, allowing the production of devices previously limited to traditional cleanroom fabrication.
    High-resolution techniques like two-photon polymerization, electrohydrodynamic jet printing, and computed axial lithographyare now being used to create structures with feature sizes down to 100 nanometers. These capabilities have broad implications for biomedical sensors, flexible electronics, and microfluidic systems used in diagnostics and environmental monitoring.
    Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature.
    Classification of High-Precision Additive Processes
    Seven categories of additive manufacturing, as defined by the American Society for Testing and Materialsserve as the foundation for modern 3D printing workflows: binder jetting, directed energy deposition, material extrusion, material jetting, powder bed fusion, sheet lamination, and vat photopolymerization.
    Among these, 2PP provides the finest resolution, enabling the fabrication of nanoscale features for optical communication components and MEMS support structures. Inkjet-based material jetting and direct ink writingallow patterned deposition of conductive or biological materials, including stretchable gels and ionic polymers. Binder jetting, which operates by spraying adhesives onto powdered substrates, is particularly suited for large-volume structures using metals or ceramics with minimal thermal stress.
    Fused deposition modeling, a form of material extrusion, continues to be widely used for its low cost and compatibility with thermoplastics. Although limited in resolution, it remains practical for building mechanical supports or sacrificial molds in soft lithography.
    Various micro-scale 3D printing strategies. Image via Springer Nature.
    3D Printing in Microelectronics, MEMS, and Sensing
    Additive manufacturing is now routinely used to fabricate microsensors, microelectromechanical systemactuators, and flexible electronics. Compared to traditional lithographic processes, 3D printing reduces material waste and bypasses the need for masks or etching steps.
    In one example cited by the review, flexible multi-directional sensors were printed directly onto skin-like substrates using a customized FDM platform. Another case involved a cantilever support for a micro-accelerometer produced via 2PP and coated with conductive materials through evaporation. These examples show how additive techniques can fabricate both support and functional layers with high geometric complexity.
    MEMS actuators fabricated with additive methods often combine printed scaffolds with conventional micromachining. A 2PP-printed spiral structure was used to house liquid metal in an electrothermal actuator. Separately, FDM was used to print a MEMS switch, combining conductive PLA and polyvinyl alcohol as the sacrificial layer. However, achieving the mechanical precision needed for switching elements remains a barrier for fully integrated use.
    3D printing material and preparation methods. Image via Springer Nature.
    Development of Functional Inks and Composite Materials
    Microelectronic applications depend on the availability of printable materials with specific electrical, mechanical, or chemical properties. MXene-based conductive inks, metal particle suspensions, and piezoelectric composites are being optimized for use in DIW, inkjet, and light-curing platforms.
    Researchers have fabricated planar asymmetric micro-supercapacitors using ink composed of nickel sulfide on nitrogen-doped MXene. These devices demonstrate increased voltage windowsand volumetric capacitance, meeting the demands of compact power systems. Other work involves composite hydrogels with ionic conductivity and high tensile stretch, used in flexible biosensing applications.
    PEDOT:PSS, a common conductive polymer, has been formulated into a high-resolution ink using lyophilization and re-dispersion in photocurable matrices. These formulations are used to create electrode arrays for neural probes and flexible circuits. Multiphoton lithography has also been applied to print complex 3D structures from organic semiconductor resins.
    Bioelectronic applications are driving the need for biocompatible inks that can perform reliably in wet and dynamic environments. One group incorporated graphene nanoplatelets and carbon nanotubes into ink for multi-jet fusion, producing pressure sensors with high mechanical durability and signal sensitivity.
    3D printed electronics achieved through the integration of active initiators into printing materials. Image via Springer Nature.
    Microfluidic Devices Fabricated via Direct and Indirect Methods
    Microfluidic systems have traditionally relied on soft lithography techniques using polydimethylsiloxane. Additive manufacturing now offers alternatives through both direct printing of fluidic chips and indirect fabrication using 3D printed molds.
    Direct fabrication using SLA, DLP, or inkjet-based systems allows the rapid prototyping of chips with integrated reservoirs and channels. However, achieving sub-100 µm channels requires careful calibration. One group demonstrated channels as small as 18 µm × 20 µm using a customized DLP printer.
    Indirect fabrication relies on printing sacrificial or reusable molds, followed by casting and demolding. PLA, ABS, and resin-based molds are commonly used, depending on whether water-soluble or solvent-dissolvable materials are preferred. These techniques are compatible with PDMS and reduce reliance on photolithography equipment.
    Surface roughness and optical transparency remain concerns. FDM-printed molds often introduce layer artifacts, while uncured resin in SLA methods can leach toxins or inhibit PDMS curing. Some teams address these issues by polishing surfaces post-print or chemically treating molds to improve release characteristics.
    Integration and Future Directions for Microdevices
    3D printed microfluidic devices in biology and chemistry.Image via Springer Nature.
    3D printing is increasingly enabling the integration of structural, electrical, and sensing components into single build processes. Multi-material printers are beginning to produce substrates, conductive paths, and dielectric layers in tandem, although component embedding still requires manual intervention.
    Applications in wearable electronics, flexible sensors, and soft robotics continue to expand. Stretchable conductors printed onto elastomeric backings are being used to simulate mechanoreceptors and thermoreceptors for electronic skin systems. Piezoelectric materials such as BaTiO₃-PVDF composites are under investigation for printed actuators and energy harvesters.
    MEMS fabrication remains constrained by the mechanical limitations of printable materials. Silicon continues to dominate high-performance actuators due to its stiffness and precision. Additive methods are currently better suited for producing packaging, connectors, and sacrificial scaffolds within MEMS systems.
    Multi-photon and light-assisted processes are being explored for producing active devices like microcapacitors and accelerometers. Recent work demonstrated the use of 2PP to fabricate nitrogen-vacancy center–based quantum sensors, capable of detecting thermal and magnetic fluctuations in microscopic environments.
    As materials, resolution, and system integration improve, 3D printing is poised to shift from peripheral use to a central role in microsystem design and production. 
    3D printing micro-nano devices. Image via Springer Nature.
    Ready to discover who won the 20243D Printing Industry Awards?
    Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights.
    Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes.
    Featured image shows an Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature.

    Anyer Tenorio Lara
    Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology.
    #mapping #expanding #role #printing #micro
    Mapping the Expanding Role of 3D Printing in Micro and Nano Device Fabrication
    A new review by researchers from the Beijing University of Posts and Telecommunications, CETC 54, Sun Yat-sen University, Shenzhen University, and the University of Electronic Science and Technology of China surveys the latest developments in 3D printing for microelectronic and microfluidic applications. The paper released on Springer Nature Link highlights how additive manufacturing methods have reached sub-micron precision, allowing the production of devices previously limited to traditional cleanroom fabrication. High-resolution techniques like two-photon polymerization, electrohydrodynamic jet printing, and computed axial lithographyare now being used to create structures with feature sizes down to 100 nanometers. These capabilities have broad implications for biomedical sensors, flexible electronics, and microfluidic systems used in diagnostics and environmental monitoring. Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature. Classification of High-Precision Additive Processes Seven categories of additive manufacturing, as defined by the American Society for Testing and Materialsserve as the foundation for modern 3D printing workflows: binder jetting, directed energy deposition, material extrusion, material jetting, powder bed fusion, sheet lamination, and vat photopolymerization. Among these, 2PP provides the finest resolution, enabling the fabrication of nanoscale features for optical communication components and MEMS support structures. Inkjet-based material jetting and direct ink writingallow patterned deposition of conductive or biological materials, including stretchable gels and ionic polymers. Binder jetting, which operates by spraying adhesives onto powdered substrates, is particularly suited for large-volume structures using metals or ceramics with minimal thermal stress. Fused deposition modeling, a form of material extrusion, continues to be widely used for its low cost and compatibility with thermoplastics. Although limited in resolution, it remains practical for building mechanical supports or sacrificial molds in soft lithography. Various micro-scale 3D printing strategies. Image via Springer Nature. 3D Printing in Microelectronics, MEMS, and Sensing Additive manufacturing is now routinely used to fabricate microsensors, microelectromechanical systemactuators, and flexible electronics. Compared to traditional lithographic processes, 3D printing reduces material waste and bypasses the need for masks or etching steps. In one example cited by the review, flexible multi-directional sensors were printed directly onto skin-like substrates using a customized FDM platform. Another case involved a cantilever support for a micro-accelerometer produced via 2PP and coated with conductive materials through evaporation. These examples show how additive techniques can fabricate both support and functional layers with high geometric complexity. MEMS actuators fabricated with additive methods often combine printed scaffolds with conventional micromachining. A 2PP-printed spiral structure was used to house liquid metal in an electrothermal actuator. Separately, FDM was used to print a MEMS switch, combining conductive PLA and polyvinyl alcohol as the sacrificial layer. However, achieving the mechanical precision needed for switching elements remains a barrier for fully integrated use. 3D printing material and preparation methods. Image via Springer Nature. Development of Functional Inks and Composite Materials Microelectronic applications depend on the availability of printable materials with specific electrical, mechanical, or chemical properties. MXene-based conductive inks, metal particle suspensions, and piezoelectric composites are being optimized for use in DIW, inkjet, and light-curing platforms. Researchers have fabricated planar asymmetric micro-supercapacitors using ink composed of nickel sulfide on nitrogen-doped MXene. These devices demonstrate increased voltage windowsand volumetric capacitance, meeting the demands of compact power systems. Other work involves composite hydrogels with ionic conductivity and high tensile stretch, used in flexible biosensing applications. PEDOT:PSS, a common conductive polymer, has been formulated into a high-resolution ink using lyophilization and re-dispersion in photocurable matrices. These formulations are used to create electrode arrays for neural probes and flexible circuits. Multiphoton lithography has also been applied to print complex 3D structures from organic semiconductor resins. Bioelectronic applications are driving the need for biocompatible inks that can perform reliably in wet and dynamic environments. One group incorporated graphene nanoplatelets and carbon nanotubes into ink for multi-jet fusion, producing pressure sensors with high mechanical durability and signal sensitivity. 3D printed electronics achieved through the integration of active initiators into printing materials. Image via Springer Nature. Microfluidic Devices Fabricated via Direct and Indirect Methods Microfluidic systems have traditionally relied on soft lithography techniques using polydimethylsiloxane. Additive manufacturing now offers alternatives through both direct printing of fluidic chips and indirect fabrication using 3D printed molds. Direct fabrication using SLA, DLP, or inkjet-based systems allows the rapid prototyping of chips with integrated reservoirs and channels. However, achieving sub-100 µm channels requires careful calibration. One group demonstrated channels as small as 18 µm × 20 µm using a customized DLP printer. Indirect fabrication relies on printing sacrificial or reusable molds, followed by casting and demolding. PLA, ABS, and resin-based molds are commonly used, depending on whether water-soluble or solvent-dissolvable materials are preferred. These techniques are compatible with PDMS and reduce reliance on photolithography equipment. Surface roughness and optical transparency remain concerns. FDM-printed molds often introduce layer artifacts, while uncured resin in SLA methods can leach toxins or inhibit PDMS curing. Some teams address these issues by polishing surfaces post-print or chemically treating molds to improve release characteristics. Integration and Future Directions for Microdevices 3D printed microfluidic devices in biology and chemistry.Image via Springer Nature. 3D printing is increasingly enabling the integration of structural, electrical, and sensing components into single build processes. Multi-material printers are beginning to produce substrates, conductive paths, and dielectric layers in tandem, although component embedding still requires manual intervention. Applications in wearable electronics, flexible sensors, and soft robotics continue to expand. Stretchable conductors printed onto elastomeric backings are being used to simulate mechanoreceptors and thermoreceptors for electronic skin systems. Piezoelectric materials such as BaTiO₃-PVDF composites are under investigation for printed actuators and energy harvesters. MEMS fabrication remains constrained by the mechanical limitations of printable materials. Silicon continues to dominate high-performance actuators due to its stiffness and precision. Additive methods are currently better suited for producing packaging, connectors, and sacrificial scaffolds within MEMS systems. Multi-photon and light-assisted processes are being explored for producing active devices like microcapacitors and accelerometers. Recent work demonstrated the use of 2PP to fabricate nitrogen-vacancy center–based quantum sensors, capable of detecting thermal and magnetic fluctuations in microscopic environments. As materials, resolution, and system integration improve, 3D printing is poised to shift from peripheral use to a central role in microsystem design and production.  3D printing micro-nano devices. Image via Springer Nature. Ready to discover who won the 20243D Printing Industry Awards? Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights. Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes. Featured image shows an Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature. Anyer Tenorio Lara Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology. #mapping #expanding #role #printing #micro
    3DPRINTINGINDUSTRY.COM
    Mapping the Expanding Role of 3D Printing in Micro and Nano Device Fabrication
    A new review by researchers from the Beijing University of Posts and Telecommunications, CETC 54 (54th Research Institute of Electronics Technology Group Corporation), Sun Yat-sen University, Shenzhen University, and the University of Electronic Science and Technology of China surveys the latest developments in 3D printing for microelectronic and microfluidic applications. The paper released on Springer Nature Link highlights how additive manufacturing methods have reached sub-micron precision, allowing the production of devices previously limited to traditional cleanroom fabrication. High-resolution techniques like two-photon polymerization (2PP), electrohydrodynamic jet printing, and computed axial lithography (CAL) are now being used to create structures with feature sizes down to 100 nanometers. These capabilities have broad implications for biomedical sensors, flexible electronics, and microfluidic systems used in diagnostics and environmental monitoring. Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature. Classification of High-Precision Additive Processes Seven categories of additive manufacturing, as defined by the American Society for Testing and Materials (ASTM) serve as the foundation for modern 3D printing workflows: binder jetting, directed energy deposition (DED), material extrusion (MEX), material jetting, powder bed fusion (PBF), sheet lamination (SHL), and vat photopolymerization (VP). Among these, 2PP provides the finest resolution, enabling the fabrication of nanoscale features for optical communication components and MEMS support structures. Inkjet-based material jetting and direct ink writing (DIW) allow patterned deposition of conductive or biological materials, including stretchable gels and ionic polymers. Binder jetting, which operates by spraying adhesives onto powdered substrates, is particularly suited for large-volume structures using metals or ceramics with minimal thermal stress. Fused deposition modeling, a form of material extrusion, continues to be widely used for its low cost and compatibility with thermoplastics. Although limited in resolution, it remains practical for building mechanical supports or sacrificial molds in soft lithography. Various micro-scale 3D printing strategies. Image via Springer Nature. 3D Printing in Microelectronics, MEMS, and Sensing Additive manufacturing is now routinely used to fabricate microsensors, microelectromechanical system (MEMS) actuators, and flexible electronics. Compared to traditional lithographic processes, 3D printing reduces material waste and bypasses the need for masks or etching steps. In one example cited by the review, flexible multi-directional sensors were printed directly onto skin-like substrates using a customized FDM platform. Another case involved a cantilever support for a micro-accelerometer produced via 2PP and coated with conductive materials through evaporation. These examples show how additive techniques can fabricate both support and functional layers with high geometric complexity. MEMS actuators fabricated with additive methods often combine printed scaffolds with conventional micromachining. A 2PP-printed spiral structure was used to house liquid metal in an electrothermal actuator. Separately, FDM was used to print a MEMS switch, combining conductive PLA and polyvinyl alcohol as the sacrificial layer. However, achieving the mechanical precision needed for switching elements remains a barrier for fully integrated use. 3D printing material and preparation methods. Image via Springer Nature. Development of Functional Inks and Composite Materials Microelectronic applications depend on the availability of printable materials with specific electrical, mechanical, or chemical properties. MXene-based conductive inks, metal particle suspensions, and piezoelectric composites are being optimized for use in DIW, inkjet, and light-curing platforms. Researchers have fabricated planar asymmetric micro-supercapacitors using ink composed of nickel sulfide on nitrogen-doped MXene. These devices demonstrate increased voltage windows (up to 1.5 V) and volumetric capacitance, meeting the demands of compact power systems. Other work involves composite hydrogels with ionic conductivity and high tensile stretch, used in flexible biosensing applications. PEDOT:PSS, a common conductive polymer, has been formulated into a high-resolution ink using lyophilization and re-dispersion in photocurable matrices. These formulations are used to create electrode arrays for neural probes and flexible circuits. Multiphoton lithography has also been applied to print complex 3D structures from organic semiconductor resins. Bioelectronic applications are driving the need for biocompatible inks that can perform reliably in wet and dynamic environments. One group incorporated graphene nanoplatelets and carbon nanotubes into ink for multi-jet fusion, producing pressure sensors with high mechanical durability and signal sensitivity. 3D printed electronics achieved through the integration of active initiators into printing materials. Image via Springer Nature. Microfluidic Devices Fabricated via Direct and Indirect Methods Microfluidic systems have traditionally relied on soft lithography techniques using polydimethylsiloxane (PDMS). Additive manufacturing now offers alternatives through both direct printing of fluidic chips and indirect fabrication using 3D printed molds. Direct fabrication using SLA, DLP, or inkjet-based systems allows the rapid prototyping of chips with integrated reservoirs and channels. However, achieving sub-100 µm channels requires careful calibration. One group demonstrated channels as small as 18 µm × 20 µm using a customized DLP printer. Indirect fabrication relies on printing sacrificial or reusable molds, followed by casting and demolding. PLA, ABS, and resin-based molds are commonly used, depending on whether water-soluble or solvent-dissolvable materials are preferred. These techniques are compatible with PDMS and reduce reliance on photolithography equipment. Surface roughness and optical transparency remain concerns. FDM-printed molds often introduce layer artifacts, while uncured resin in SLA methods can leach toxins or inhibit PDMS curing. Some teams address these issues by polishing surfaces post-print or chemically treating molds to improve release characteristics. Integration and Future Directions for Microdevices 3D printed microfluidic devices in biology and chemistry.Image via Springer Nature. 3D printing is increasingly enabling the integration of structural, electrical, and sensing components into single build processes. Multi-material printers are beginning to produce substrates, conductive paths, and dielectric layers in tandem, although component embedding still requires manual intervention. Applications in wearable electronics, flexible sensors, and soft robotics continue to expand. Stretchable conductors printed onto elastomeric backings are being used to simulate mechanoreceptors and thermoreceptors for electronic skin systems. Piezoelectric materials such as BaTiO₃-PVDF composites are under investigation for printed actuators and energy harvesters. MEMS fabrication remains constrained by the mechanical limitations of printable materials. Silicon continues to dominate high-performance actuators due to its stiffness and precision. Additive methods are currently better suited for producing packaging, connectors, and sacrificial scaffolds within MEMS systems. Multi-photon and light-assisted processes are being explored for producing active devices like microcapacitors and accelerometers. Recent work demonstrated the use of 2PP to fabricate nitrogen-vacancy center–based quantum sensors, capable of detecting thermal and magnetic fluctuations in microscopic environments. As materials, resolution, and system integration improve, 3D printing is poised to shift from peripheral use to a central role in microsystem design and production.  3D printing micro-nano devices. Image via Springer Nature. Ready to discover who won the 20243D Printing Industry Awards? Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights. Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes. Featured image shows an Overview of 3D printing applications for microelectronic and microfluidic device fabrication. Image via Springer Nature. Anyer Tenorio Lara Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology.
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  • Fenix Art Museum / MAD Architects

    Fenix Art Museum / MAD ArchitectsSave this picture!© Iwan BaanMuseum, Refurbishment•Rotterdam, The Netherlands

    Architects:
    MAD Architects
    Area
    Area of this architecture project

    Area: 
    8000 m²

    Year
    Completion year of this architecture project

    Year: 

    2025

    Photographs

    Photographs:

    Manufacturers
    Brands with products used in this architecture project

    Manufacturers:  Goppion

    Project Contractors:

    Products
    translation missing: en-US.post.svg.material_description

    More SpecsLess Specs
    this picture!
    Text description provided by the architects. Fenix is a major new museum that explores migration through the lens of art, opening on a landmark site in Rotterdam's City Harbor, developed by internationally acclaimed architects MAD. With a rapidly expanding collection of historic and contemporary objects, Fenix tells the story of migration through a series of encounters with art, architecture, photography, food, and history. Located in what was once part of the world's largest transshipment warehouse, on a peninsula in Rotterdam's historic port district, Fenix overlooks the docks where millions of migrant journeys began and ended. The monumental 16,000 square meter warehouse has been transformed to become Fenix by MAD Architects with restoration consultation by Bureau Polderman. This is MAD Architects' first commission for a public cultural building in Europe, as well as the first museum to be built by a Chinese firm in Europe. The project was initiated by the Droom en Daad Foundation, founded in 2016. The Foundation is helping redefine Rotterdam for the 21st century - developing new kinds of arts and culture institutions and fostering new creative talent that reflects the city's diversity, its spirit, and its historySave this picture!Restoration of the 172-meter-long façade of the former shipping and storage warehouse began in 2018, led by Bureau Polderman, and took a year and a half to complete. Some architectural details date back to 1923 when the warehouse opened, while others were part of the 1948-1950 reconstruction plan. In the past 60 years, many additions were made and the building's function changed many 4mes. The façade lacked uniformity. Fronts and frames were rusty. All elements along the façade have now been restored, refurnished, or rebuilt. The characteristic windows were restored to reflect the style of 1923. The 2,200 sqm expanse of the south façade was blast-cleaned and cement stucco was reapplied. The characteristic sliding doors at street level have been restored to their original post-war state, with doors and frames repainted in their original green color. A serene rhythm of columns, windows, and fronts has emerged that emphasizes the horizontal quality of the building.this picture!this picture!A defining new feature of the building is the Tornado - a double helix staircase evocative of rising air that climbs from the ground floor and flows up and out of the rooftop onto an outdoor platform offering spectacular panoramic views across Rotterdam and the Maas River, 24 meters above ground level. The dynamic structure is cladded in 297 polished stainless-steel panels, made in Groningen, Netherlands. The canopy that sits at the top of the structure is 17m in length and was transported by boat from Groningen to Rotterdam in pieces before being assembled and lifted into place. Inside the Tornado is a 550m long double-helix wooden staircase which emerges onto the platform, which can also be accessed via a central shaft.this picture!Inside the building are a series of vast gallery spaces spread over two floors, housing Fenix's growing art and historical collection, as well as a series of commissions by emerging artists from across the world. The ground floor contains exhibition and programming spaces, while the upstairs galleries are dedicated to the Fenix Collection. The museum is accessed via entrances in the centre of the north façade on the riverfront and the south façade. On arrival, visitors are immediately drawn to the base of the Tornado, whose dynamic, twisting form is lit by the glass roof above the central atrium that allows natural light to filter into the lobby. The entrance atrium features a welcome desk, museum shop, and café. At 2,275 sqm, Plein is a vast, flexible space for events and performances and will host a constantly changing programme of activity curated for and with Rotterdam's communities. Located on the ground floor on the Eastern side of the building, it features doors on three sides which can be opened out to create a welcoming covered public space. Fenix offers a number of dining options located throughout the building where visitors can encounter food cultures that have travelled the world.this picture!The top of the warehouse features a 6,750 sqm 'green roof', featuring sedum plants arranged in a concentric pattern, in line with the shape of the Tornado. As well as supporting biodiversity, green roofs provide insulation and store rainwater in the plants and substrate, releasing it back into the atmosphere through evaporation. This significantly reduces the burden on the sewerage system, reducing the risk of flooding and the burden on water treatment. The building uses a Thermal Energy System, which stores excess heat from the building in the soil. A heat pump is connected to the TES to produce the correct temperature for the building. The aquifer serves as the source for the heat pump. By using the heat pump and passive cooling, it is possible to save up to 60 percent in heating energy and 80 percent in cooling energy. The staircase of the Tornado is made from sustainable Norwegian wood called Kebony, a leading modified wood brand established in Oslo, Norway, that uses a proven, innovative, patented technology to enhance traditional 4mber. Biobased modified wood is a sustainable building material with a significantly lower environmental impact than other building materials. Fenix repurposes a 100-year-old warehouse, restored as much as possible to its original state in the 1950s, with interventions in line with the original architecture from 1923.this picture!this picture!The building has been designed in consultation with VGR, an association specializing in making buildings as accessible and welcoming as possible. Plein and the Atrium will be publicly accessible spaces that are free to enter.this picture!

    Project gallerySee allShow less
    Project locationAddress:Rotterdam, The NetherlandsLocation to be used only as a reference. It could indicate city/country but not exact address.About this officeMAD ArchitectsOffice•••
    MaterialsSteelConcreteMaterials and TagsPublished on May 21, 2025Cite: "Fenix Art Museum / MAD Architects" 21 May 2025. ArchDaily. Accessed . < ISSN 0719-8884Save世界上最受欢迎的建筑网站现已推出你的母语版本!想浏览ArchDaily中国吗?是否
    You've started following your first account!Did you know?You'll now receive updates based on what you follow! Personalize your stream and start following your favorite authors, offices and users.Go to my stream
    #fenix #art #museum #mad #architects
    Fenix Art Museum / MAD Architects
    Fenix Art Museum / MAD ArchitectsSave this picture!© Iwan BaanMuseum, Refurbishment•Rotterdam, The Netherlands Architects: MAD Architects Area Area of this architecture project Area:  8000 m² Year Completion year of this architecture project Year:  2025 Photographs Photographs: Manufacturers Brands with products used in this architecture project Manufacturers:  Goppion Project Contractors: Products translation missing: en-US.post.svg.material_description More SpecsLess Specs this picture! Text description provided by the architects. Fenix is a major new museum that explores migration through the lens of art, opening on a landmark site in Rotterdam's City Harbor, developed by internationally acclaimed architects MAD. With a rapidly expanding collection of historic and contemporary objects, Fenix tells the story of migration through a series of encounters with art, architecture, photography, food, and history. Located in what was once part of the world's largest transshipment warehouse, on a peninsula in Rotterdam's historic port district, Fenix overlooks the docks where millions of migrant journeys began and ended. The monumental 16,000 square meter warehouse has been transformed to become Fenix by MAD Architects with restoration consultation by Bureau Polderman. This is MAD Architects' first commission for a public cultural building in Europe, as well as the first museum to be built by a Chinese firm in Europe. The project was initiated by the Droom en Daad Foundation, founded in 2016. The Foundation is helping redefine Rotterdam for the 21st century - developing new kinds of arts and culture institutions and fostering new creative talent that reflects the city's diversity, its spirit, and its historySave this picture!Restoration of the 172-meter-long façade of the former shipping and storage warehouse began in 2018, led by Bureau Polderman, and took a year and a half to complete. Some architectural details date back to 1923 when the warehouse opened, while others were part of the 1948-1950 reconstruction plan. In the past 60 years, many additions were made and the building's function changed many 4mes. The façade lacked uniformity. Fronts and frames were rusty. All elements along the façade have now been restored, refurnished, or rebuilt. The characteristic windows were restored to reflect the style of 1923. The 2,200 sqm expanse of the south façade was blast-cleaned and cement stucco was reapplied. The characteristic sliding doors at street level have been restored to their original post-war state, with doors and frames repainted in their original green color. A serene rhythm of columns, windows, and fronts has emerged that emphasizes the horizontal quality of the building.this picture!this picture!A defining new feature of the building is the Tornado - a double helix staircase evocative of rising air that climbs from the ground floor and flows up and out of the rooftop onto an outdoor platform offering spectacular panoramic views across Rotterdam and the Maas River, 24 meters above ground level. The dynamic structure is cladded in 297 polished stainless-steel panels, made in Groningen, Netherlands. The canopy that sits at the top of the structure is 17m in length and was transported by boat from Groningen to Rotterdam in pieces before being assembled and lifted into place. Inside the Tornado is a 550m long double-helix wooden staircase which emerges onto the platform, which can also be accessed via a central shaft.this picture!Inside the building are a series of vast gallery spaces spread over two floors, housing Fenix's growing art and historical collection, as well as a series of commissions by emerging artists from across the world. The ground floor contains exhibition and programming spaces, while the upstairs galleries are dedicated to the Fenix Collection. The museum is accessed via entrances in the centre of the north façade on the riverfront and the south façade. On arrival, visitors are immediately drawn to the base of the Tornado, whose dynamic, twisting form is lit by the glass roof above the central atrium that allows natural light to filter into the lobby. The entrance atrium features a welcome desk, museum shop, and café. At 2,275 sqm, Plein is a vast, flexible space for events and performances and will host a constantly changing programme of activity curated for and with Rotterdam's communities. Located on the ground floor on the Eastern side of the building, it features doors on three sides which can be opened out to create a welcoming covered public space. Fenix offers a number of dining options located throughout the building where visitors can encounter food cultures that have travelled the world.this picture!The top of the warehouse features a 6,750 sqm 'green roof', featuring sedum plants arranged in a concentric pattern, in line with the shape of the Tornado. As well as supporting biodiversity, green roofs provide insulation and store rainwater in the plants and substrate, releasing it back into the atmosphere through evaporation. This significantly reduces the burden on the sewerage system, reducing the risk of flooding and the burden on water treatment. The building uses a Thermal Energy System, which stores excess heat from the building in the soil. A heat pump is connected to the TES to produce the correct temperature for the building. The aquifer serves as the source for the heat pump. By using the heat pump and passive cooling, it is possible to save up to 60 percent in heating energy and 80 percent in cooling energy. The staircase of the Tornado is made from sustainable Norwegian wood called Kebony, a leading modified wood brand established in Oslo, Norway, that uses a proven, innovative, patented technology to enhance traditional 4mber. Biobased modified wood is a sustainable building material with a significantly lower environmental impact than other building materials. Fenix repurposes a 100-year-old warehouse, restored as much as possible to its original state in the 1950s, with interventions in line with the original architecture from 1923.this picture!this picture!The building has been designed in consultation with VGR, an association specializing in making buildings as accessible and welcoming as possible. Plein and the Atrium will be publicly accessible spaces that are free to enter.this picture! Project gallerySee allShow less Project locationAddress:Rotterdam, The NetherlandsLocation to be used only as a reference. It could indicate city/country but not exact address.About this officeMAD ArchitectsOffice••• MaterialsSteelConcreteMaterials and TagsPublished on May 21, 2025Cite: "Fenix Art Museum / MAD Architects" 21 May 2025. ArchDaily. Accessed . < ISSN 0719-8884Save世界上最受欢迎的建筑网站现已推出你的母语版本!想浏览ArchDaily中国吗?是否 You've started following your first account!Did you know?You'll now receive updates based on what you follow! Personalize your stream and start following your favorite authors, offices and users.Go to my stream #fenix #art #museum #mad #architects
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    Fenix Art Museum / MAD Architects
    Fenix Art Museum / MAD ArchitectsSave this picture!© Iwan BaanMuseum, Refurbishment•Rotterdam, The Netherlands Architects: MAD Architects Area Area of this architecture project Area:  8000 m² Year Completion year of this architecture project Year:  2025 Photographs Photographs: Manufacturers Brands with products used in this architecture project Manufacturers:  Goppion Project Contractors: Products translation missing: en-US.post.svg.material_description More SpecsLess Specs Save this picture! Text description provided by the architects. Fenix is a major new museum that explores migration through the lens of art, opening on a landmark site in Rotterdam's City Harbor, developed by internationally acclaimed architects MAD. With a rapidly expanding collection of historic and contemporary objects, Fenix tells the story of migration through a series of encounters with art, architecture, photography, food, and history. Located in what was once part of the world's largest transshipment warehouse, on a peninsula in Rotterdam's historic port district, Fenix overlooks the docks where millions of migrant journeys began and ended. The monumental 16,000 square meter warehouse has been transformed to become Fenix by MAD Architects with restoration consultation by Bureau Polderman. This is MAD Architects' first commission for a public cultural building in Europe, as well as the first museum to be built by a Chinese firm in Europe. The project was initiated by the Droom en Daad Foundation, founded in 2016. The Foundation is helping redefine Rotterdam for the 21st century - developing new kinds of arts and culture institutions and fostering new creative talent that reflects the city's diversity, its spirit, and its historySave this picture!Restoration of the 172-meter-long façade of the former shipping and storage warehouse began in 2018, led by Bureau Polderman, and took a year and a half to complete. Some architectural details date back to 1923 when the warehouse opened, while others were part of the 1948-1950 reconstruction plan. In the past 60 years, many additions were made and the building's function changed many 4mes. The façade lacked uniformity. Fronts and frames were rusty. All elements along the façade have now been restored, refurnished, or rebuilt. The characteristic windows were restored to reflect the style of 1923. The 2,200 sqm expanse of the south façade was blast-cleaned and cement stucco was reapplied. The characteristic sliding doors at street level have been restored to their original post-war state, with doors and frames repainted in their original green color. A serene rhythm of columns, windows, and fronts has emerged that emphasizes the horizontal quality of the building.Save this picture!Save this picture!A defining new feature of the building is the Tornado - a double helix staircase evocative of rising air that climbs from the ground floor and flows up and out of the rooftop onto an outdoor platform offering spectacular panoramic views across Rotterdam and the Maas River, 24 meters above ground level. The dynamic structure is cladded in 297 polished stainless-steel panels, made in Groningen, Netherlands. The canopy that sits at the top of the structure is 17m in length and was transported by boat from Groningen to Rotterdam in pieces before being assembled and lifted into place. Inside the Tornado is a 550m long double-helix wooden staircase which emerges onto the platform, which can also be accessed via a central shaft.Save this picture!Inside the building are a series of vast gallery spaces spread over two floors, housing Fenix's growing art and historical collection, as well as a series of commissions by emerging artists from across the world. The ground floor contains exhibition and programming spaces, while the upstairs galleries are dedicated to the Fenix Collection. The museum is accessed via entrances in the centre of the north façade on the riverfront and the south façade. On arrival, visitors are immediately drawn to the base of the Tornado, whose dynamic, twisting form is lit by the glass roof above the central atrium that allows natural light to filter into the lobby. The entrance atrium features a welcome desk, museum shop, and café. At 2,275 sqm, Plein is a vast, flexible space for events and performances and will host a constantly changing programme of activity curated for and with Rotterdam's communities. Located on the ground floor on the Eastern side of the building, it features doors on three sides which can be opened out to create a welcoming covered public space. Fenix offers a number of dining options located throughout the building where visitors can encounter food cultures that have travelled the world.Save this picture!The top of the warehouse features a 6,750 sqm 'green roof', featuring sedum plants arranged in a concentric pattern, in line with the shape of the Tornado. As well as supporting biodiversity, green roofs provide insulation and store rainwater in the plants and substrate, releasing it back into the atmosphere through evaporation. This significantly reduces the burden on the sewerage system, reducing the risk of flooding and the burden on water treatment. The building uses a Thermal Energy System (TES), which stores excess heat from the building in the soil. A heat pump is connected to the TES to produce the correct temperature for the building. The aquifer serves as the source for the heat pump. By using the heat pump and passive cooling, it is possible to save up to 60 percent in heating energy and 80 percent in cooling energy. The staircase of the Tornado is made from sustainable Norwegian wood called Kebony, a leading modified wood brand established in Oslo, Norway, that uses a proven, innovative, patented technology to enhance traditional 4mber. Biobased modified wood is a sustainable building material with a significantly lower environmental impact than other building materials. Fenix repurposes a 100-year-old warehouse, restored as much as possible to its original state in the 1950s, with interventions in line with the original architecture from 1923.Save this picture!Save this picture!The building has been designed in consultation with VGR, an association specializing in making buildings as accessible and welcoming as possible. Plein and the Atrium will be publicly accessible spaces that are free to enter.Save this picture! Project gallerySee allShow less Project locationAddress:Rotterdam, The NetherlandsLocation to be used only as a reference. It could indicate city/country but not exact address.About this officeMAD ArchitectsOffice••• MaterialsSteelConcreteMaterials and TagsPublished on May 21, 2025Cite: "Fenix Art Museum / MAD Architects" 21 May 2025. ArchDaily. Accessed . <https://www.archdaily.com/1030328/fenix-art-museum-mad-architects&gt ISSN 0719-8884Save世界上最受欢迎的建筑网站现已推出你的母语版本!想浏览ArchDaily中国吗?是否 You've started following your first account!Did you know?You'll now receive updates based on what you follow! Personalize your stream and start following your favorite authors, offices and users.Go to my stream
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  • Titomic and nuForj Join Forces to Expand Cold Spray Additive Manufacturing in the U.S.

    Titomic Limited, an Australian company specializing in cold spray additive manufacturing through its proprietary Titomic Kinetic Fusionprocess, has signed a strategic partnership with U.S.-based advanced manufacturing provider nuForj. The agreement is intended to accelerate the commercialization of TKF in North American sectors including aerospace, defense, education, and industrial manufacturing.
    nuForj will act as a regional commercialization and technology partner for TKF, a process that deposits metal powders at supersonic speed without melting them. This solid-state method enables near-net-shape production, coating, and repair of metal components at high speed and efficiency. Under the partnership, the companies aim to establish a network of additive manufacturing hubs and implement training programs that introduce cold spray manufacturing techniques to engineering students and workforce development initiatives.
    “This partnership represents a leap forward in our global strategy,” said Jim Simpson, CEO and Managing Director of Titomic. “Working alongside nuForj allows us to bring TKF technology to critical U.S. markets with agility and deep local insight.” Dr. Patti Dare, President of Titomic USA, noted that the collaboration “paves the way for joint R&D initiatives and the deployment of advanced manufacturing hubs across North America.” Rudy Vogel, Founder and CEO of nuForj, added: “We believe Industry 4.0 technologies and digital transformation of the factory floor are essential to reindustrializing the U.S., powering new business models and driving productivity growth. Titomic Kinetic Fusion is an impressive technology for producing quality metal parts incredibly fast and efficiently, and we’re looking forward to making it accessible to scores of companies across the country committed to American manufacturing.”
    Titomic Kinetic Fusionsystem deployed for high-speed cold spray additive manufacturing. Photo via Titomic.
    Titomic’s TKF process differs from conventional 3D printing in that it does not require melting metal feedstock. Instead, metal powders are accelerated through a nozzle using compressed gas and fused upon impact, allowing for the production of corrosion-resistant and mechanically robust components. This approach reduces thermal distortion and enables rapid buildup of material on both new and existing substrates. The process is particularly suitable for large-scale applications and complex geometries, including part restoration and protective coatings in aerospace and defense systems.
    nuForj, based in the United States, focuses on integrating Industry 4.0 principles with digital factory solutions. Its collaboration with Titomic will support the deployment of localized additive manufacturing hubs designed to reduce logistical overhead and improve access to cold spray-based production services. In addition to offering contract manufacturing, nuForj is also positioned to serve as a training and education facilitator, helping to build a workforce familiar with advanced solid-state manufacturing methods.
    Strategic U.S. Investments Bolster Additive Manufacturing Ecosystem
    Recent developments in the U.S. additive manufacturing sector reflect a coordinated push toward reshoring industrial capacity through long-term material supply agreements and advanced hardware deployment. Mmetal 3D printer manufacturer Velo3D signed a million exclusive supply agreement with Australia-based Amaero to source refractory alloy powders, including niobium and titanium variants. As part of the deal, Velo3D will qualify Amaero’s powders for use across its Sapphire printer family and integrate them into machine licensing packages. Velo3D has committed to using these materials across its Rapid Production Solutionsservices, dedicating specific systems to C103 and titanium alloy output. 
    Meanwhile, SyBridge Technologies has expanded its partnership with Carbon, a 3D printing company known for its Digital Light Synthesisplatform. The expansion includes more than doubling its DLS-dedicated manufacturing space at its Chicago-area facility to accommodate increasing orders tied to reshoring efforts. SyBridge has produced nearly two million parts with Carbon’s platform, citing advantages in geometric freedom, mechanical consistency, and cost-efficient high-volume output. SyBridge CEO Byron J. Paul emphasized that the investment enables American firms to reduce supply chain exposure and establish scalable, tariff-free production capacity using engineering-grade materials.
    Ready to discover who won the 20243D Printing Industry Awards?
    Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights.
    Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes.
    Featured image shows Titomic Kinetic Fusionsystem deployed for high-speed cold spray additive manufacturing. Photo via Titomic.

    Anyer Tenorio Lara
    Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology.
    #titomic #nuforj #join #forces #expand
    Titomic and nuForj Join Forces to Expand Cold Spray Additive Manufacturing in the U.S.
    Titomic Limited, an Australian company specializing in cold spray additive manufacturing through its proprietary Titomic Kinetic Fusionprocess, has signed a strategic partnership with U.S.-based advanced manufacturing provider nuForj. The agreement is intended to accelerate the commercialization of TKF in North American sectors including aerospace, defense, education, and industrial manufacturing. nuForj will act as a regional commercialization and technology partner for TKF, a process that deposits metal powders at supersonic speed without melting them. This solid-state method enables near-net-shape production, coating, and repair of metal components at high speed and efficiency. Under the partnership, the companies aim to establish a network of additive manufacturing hubs and implement training programs that introduce cold spray manufacturing techniques to engineering students and workforce development initiatives. “This partnership represents a leap forward in our global strategy,” said Jim Simpson, CEO and Managing Director of Titomic. “Working alongside nuForj allows us to bring TKF technology to critical U.S. markets with agility and deep local insight.” Dr. Patti Dare, President of Titomic USA, noted that the collaboration “paves the way for joint R&D initiatives and the deployment of advanced manufacturing hubs across North America.” Rudy Vogel, Founder and CEO of nuForj, added: “We believe Industry 4.0 technologies and digital transformation of the factory floor are essential to reindustrializing the U.S., powering new business models and driving productivity growth. Titomic Kinetic Fusion is an impressive technology for producing quality metal parts incredibly fast and efficiently, and we’re looking forward to making it accessible to scores of companies across the country committed to American manufacturing.” Titomic Kinetic Fusionsystem deployed for high-speed cold spray additive manufacturing. Photo via Titomic. Titomic’s TKF process differs from conventional 3D printing in that it does not require melting metal feedstock. Instead, metal powders are accelerated through a nozzle using compressed gas and fused upon impact, allowing for the production of corrosion-resistant and mechanically robust components. This approach reduces thermal distortion and enables rapid buildup of material on both new and existing substrates. The process is particularly suitable for large-scale applications and complex geometries, including part restoration and protective coatings in aerospace and defense systems. nuForj, based in the United States, focuses on integrating Industry 4.0 principles with digital factory solutions. Its collaboration with Titomic will support the deployment of localized additive manufacturing hubs designed to reduce logistical overhead and improve access to cold spray-based production services. In addition to offering contract manufacturing, nuForj is also positioned to serve as a training and education facilitator, helping to build a workforce familiar with advanced solid-state manufacturing methods. Strategic U.S. Investments Bolster Additive Manufacturing Ecosystem Recent developments in the U.S. additive manufacturing sector reflect a coordinated push toward reshoring industrial capacity through long-term material supply agreements and advanced hardware deployment. Mmetal 3D printer manufacturer Velo3D signed a million exclusive supply agreement with Australia-based Amaero to source refractory alloy powders, including niobium and titanium variants. As part of the deal, Velo3D will qualify Amaero’s powders for use across its Sapphire printer family and integrate them into machine licensing packages. Velo3D has committed to using these materials across its Rapid Production Solutionsservices, dedicating specific systems to C103 and titanium alloy output.  Meanwhile, SyBridge Technologies has expanded its partnership with Carbon, a 3D printing company known for its Digital Light Synthesisplatform. The expansion includes more than doubling its DLS-dedicated manufacturing space at its Chicago-area facility to accommodate increasing orders tied to reshoring efforts. SyBridge has produced nearly two million parts with Carbon’s platform, citing advantages in geometric freedom, mechanical consistency, and cost-efficient high-volume output. SyBridge CEO Byron J. Paul emphasized that the investment enables American firms to reduce supply chain exposure and establish scalable, tariff-free production capacity using engineering-grade materials. Ready to discover who won the 20243D Printing Industry Awards? Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights. Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes. Featured image shows Titomic Kinetic Fusionsystem deployed for high-speed cold spray additive manufacturing. Photo via Titomic. Anyer Tenorio Lara Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology. #titomic #nuforj #join #forces #expand
    3DPRINTINGINDUSTRY.COM
    Titomic and nuForj Join Forces to Expand Cold Spray Additive Manufacturing in the U.S.
    Titomic Limited, an Australian company specializing in cold spray additive manufacturing through its proprietary Titomic Kinetic Fusion (TKF) process, has signed a strategic partnership with U.S.-based advanced manufacturing provider nuForj. The agreement is intended to accelerate the commercialization of TKF in North American sectors including aerospace, defense, education, and industrial manufacturing. nuForj will act as a regional commercialization and technology partner for TKF, a process that deposits metal powders at supersonic speed without melting them. This solid-state method enables near-net-shape production, coating, and repair of metal components at high speed and efficiency. Under the partnership, the companies aim to establish a network of additive manufacturing hubs and implement training programs that introduce cold spray manufacturing techniques to engineering students and workforce development initiatives. “This partnership represents a leap forward in our global strategy,” said Jim Simpson, CEO and Managing Director of Titomic. “Working alongside nuForj allows us to bring TKF technology to critical U.S. markets with agility and deep local insight.” Dr. Patti Dare, President of Titomic USA, noted that the collaboration “paves the way for joint R&D initiatives and the deployment of advanced manufacturing hubs across North America.” Rudy Vogel, Founder and CEO of nuForj, added: “We believe Industry 4.0 technologies and digital transformation of the factory floor are essential to reindustrializing the U.S., powering new business models and driving productivity growth. Titomic Kinetic Fusion is an impressive technology for producing quality metal parts incredibly fast and efficiently, and we’re looking forward to making it accessible to scores of companies across the country committed to American manufacturing.” Titomic Kinetic Fusion (TKF) system deployed for high-speed cold spray additive manufacturing. Photo via Titomic. Titomic’s TKF process differs from conventional 3D printing in that it does not require melting metal feedstock. Instead, metal powders are accelerated through a nozzle using compressed gas and fused upon impact, allowing for the production of corrosion-resistant and mechanically robust components. This approach reduces thermal distortion and enables rapid buildup of material on both new and existing substrates. The process is particularly suitable for large-scale applications and complex geometries, including part restoration and protective coatings in aerospace and defense systems. nuForj, based in the United States, focuses on integrating Industry 4.0 principles with digital factory solutions. Its collaboration with Titomic will support the deployment of localized additive manufacturing hubs designed to reduce logistical overhead and improve access to cold spray-based production services. In addition to offering contract manufacturing, nuForj is also positioned to serve as a training and education facilitator, helping to build a workforce familiar with advanced solid-state manufacturing methods. Strategic U.S. Investments Bolster Additive Manufacturing Ecosystem Recent developments in the U.S. additive manufacturing sector reflect a coordinated push toward reshoring industrial capacity through long-term material supply agreements and advanced hardware deployment. Mmetal 3D printer manufacturer Velo3D signed a $22 million exclusive supply agreement with Australia-based Amaero to source refractory alloy powders, including niobium and titanium variants. As part of the deal, Velo3D will qualify Amaero’s powders for use across its Sapphire printer family and integrate them into machine licensing packages. Velo3D has committed to using these materials across its Rapid Production Solutions (RPS) services, dedicating specific systems to C103 and titanium alloy output.  Meanwhile, SyBridge Technologies has expanded its partnership with Carbon, a 3D printing company known for its Digital Light Synthesis (DLS) platform. The expansion includes more than doubling its DLS-dedicated manufacturing space at its Chicago-area facility to accommodate increasing orders tied to reshoring efforts. SyBridge has produced nearly two million parts with Carbon’s platform, citing advantages in geometric freedom, mechanical consistency, and cost-efficient high-volume output. SyBridge CEO Byron J. Paul emphasized that the investment enables American firms to reduce supply chain exposure and establish scalable, tariff-free production capacity using engineering-grade materials. Ready to discover who won the 20243D Printing Industry Awards? Subscribe to the 3D Printing Industry newsletter to stay updated with the latest news and insights. Take the 3DPI Reader Survey — shape the future of AM reporting in under 5 minutes. Featured image shows Titomic Kinetic Fusion (TKF) system deployed for high-speed cold spray additive manufacturing. Photo via Titomic. Anyer Tenorio Lara Anyer Tenorio Lara is an emerging tech journalist passionate about uncovering the latest advances in technology and innovation. With a sharp eye for detail and a talent for storytelling, Anyer has quickly made a name for himself in the tech community. Anyer's articles aim to make complex subjects accessible and engaging for a broad audience. In addition to his writing, Anyer enjoys participating in industry events and discussions, eager to learn and share knowledge in the dynamic world of technology.
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