While chiplets have been around for decades, their use was historically limited to specific, specialized applications. Today, however, they are at the forefront of technology, powering millions of desktop PCs, workstations, servers, gaming consoles, phones, and even wearable devices worldwide.In a matter of a few years, most leading chipmakers have embraced chiplet technology to drive innovation. It's now clear that chiplets are poised to become the industry standard. Let's explore what makes them so significant and how they're shaping the future of technology.TL;DR: What are chiplets?Chiplets are segmented processors. Instead of consolidating every part into a single chip (known as a monolithic approach), specific sections are manufactured as separate chips. These individual chips are then mounted together into a single package using a complex connection system.This arrangement allows the parts that can benefit from the latest fabrication methods to be shrunk in size, improving the efficiency of the process and allowing them to fit in more components.The parts of the chip that can't be significantly reduced or don't require reduction can be produced using older and more economical methods.While the process of manufacturing such processors is complex, the overall cost is typically lower. Furthermore, it offers processor companies a more manageable pathway to expand their product range.Silicon scienceTo fully understand why processor manufacturers have turned to chiplets, we must first delve into how these devices are made. CPUs and GPUs start their life as large discs made of ultra-pure silicon, typically a little under 12 inches (300 mm) in diameter and 0.04 inches (1 mm) thick.This silicon wafer undergoes a sequence of intricate steps, resulting in multiple layers of different materials insulators, dielectrics, and metals. These layers' patterns are created through a process called photolithography, where ultraviolet light is shone through an enlarged version of the pattern (a mask), and subsequently shrunk via lenses to the required size.The pattern gets repeated, at set intervals, across the surface of the wafer and each of these will ultimately become a processor. Since chips are rectangular and wafers are circular, the patterns must overlap the disc's perimeter. These overlapping parts are ultimately discarded as they are non-functional.Once completed, the wafer is tested using a probe applied to each chip. The electrical examination results inform engineers about the processor's quality against a long list of criteria. This initial stage, known as chip binning, helps determine the processor's "grade."For instance, if the chip is intended to be a CPU, every part should function correctly, operating within a set range of clock speeds at a specific voltage. Each wafer section is then categorized based on these test results.Upon completion, the wafer is cut into individual pieces, or "dies," that are viable for use. These dies are then mounted onto a substrate, akin to a specialized motherboard. The processor undergoes further packaging (for instance, with a heat spreader) before it's ready for distribution.The entire sequence can take weeks of manufacturing and companies such as TSMC and Samsung charge high fees for each wafer, anywhere between $3,000 and $20,000 depending on the process node being used."Process node" is the term used to describe the entire fabrication system. Historically, they were named after the transistor's gate length. However, as manufacturing technology improved and allowed for ever-smaller components, the nomenclature no longer followed any physical aspect of the die and now it's simply a marketing tool.Nevertheless, each new process node brings benefits over its predecessor. It might be cheaper to produce, consume less power at the same clock speed (or vice versa), or have a higher density. The latter metric measures how many components can fit within a given die area. In the graph below, you can see how this has evolved over the years for GPUs (the largest and most complex chips you'll find in a PC)...The improvements in process nodes provide a means for engineers to increase the capabilities and performance of their products, without having to use big and costly chips. However, the above graph only tells part of the story, as not every aspect of a processor can benefit from these advancements.Circuits inside chips can be allocated into one of the following broad categories:Logic handles data, math, and decision-makingMemory usually SRAM, which stores data for the logicAnalog circuits that manage signals between the chip and other devicesUnfortunately, while logic circuits continue to shrink with every major step forward in process node technology, analog circuits have barely changed and SRAM is starting to reach a limit too.While logic still forms the largest portion of the die, the amount of SRAM in today's CPUs and GPUs has significantly grown in recent years. For example, AMD's Vega 20 chip used in its Radeon VII graphics card (2019), featured a combined total of 5 MB of L1 and L2 cache. Just two GPU generations later, the Navi 21 chip powering the Radeon RX 6000 series (2020), included over 130 MB of combined cache a remarkable 25-fold increase.We can expect these to continue to increase as new generations of processors are developed, but with memory not scaling down as well as the logic, it will become increasingly less cost-effective to manufacture all of the circuitry on the same process node.In an ideal world, one would design a die where analog sections are fabricated on the largest and cheapest node, SRAM parts on a much smaller one, and logic reserved for the absolute cutting-edge technology. Unfortunately, this is not practically achievable. However, there exists an alternative approach.Divide and conquerIn 1995, Intel introduced the Pentium II, a successor to its original P5 processor. What set it apart from other processors at the time was the design hidden beneath its plastic shield: a circuit board housing two chips. The main chip contained all the processing logic and analog systems, while one or two separate SRAM modules served as Level 2 cache.While Intel manufactured the primary chip, the cache was sourced from external suppliers. This approach became fairly standard for desktop PCs in the mid-to-late 1990s, until advances in semiconductor fabrication allowed logic, memory, and analog systems to be fully integrated into a single die.Intel's Pentium II CPU in the middle, cache chips on the right. Source: WikimediaWhile Intel continued to dabble with multiple chips in the same package, it largely stuck with the so-called monolithic approach for processors i.e., one chip for everything. For most processors, there was no need for more than one die, as manufacturing techniques were proficient (and affordable) enough to keep it straightforward.However, other companies were more interested in following a multi-chip approach, most notably IBM. In 2004, it was possible to purchase an 8-chip version of the POWER4 server CPU that comprised four processors and four cache modules, all mounted within the same body (known as a multi-chip module or MCM approach).Around this time, the term "heterogeneous integration" started to appear, partially due to research work done by DARPA. Heterogeneous integration aims to separate the various sections of a processing system, fabricate them individually on nodes best suited for each, and then combine them into the same package.Today, this is better known as system-in-package (SiP) and has been the standard method for equipping smartwatches with chips from their inception. For example, the Series 1 Apple Watch houses a CPU, some DRAM and NAND Flash, multiple controllers, and other components within a single structure.An x-ray of Apple's S1 SiP. Source: iFixitA similar setup can be achieved by having different systems all on a single die (known as an SoC or system-on-a-chip). However, this approach doesn't allow for taking advantage of different node prices, nor can every component be manufactured this way.For a technology vendor, using heterogeneous integration for a niche product is one thing, but employing it for the majority of their portfolio is another. This is exactly what AMD did with its range of processors. In 2017, the semiconductor giant introduced its Zen architecture with the launch of the single-die Ryzen desktop CPU. Just a few months later, AMD debuted two multi-chip product lines: Threadripper and EPYC, with the latter featuring configurations of up to four dies.With the launch of Zen 2 two years later, AMD fully embraced HI, MCM, SiP call it what you will. They shifted the majority of the analog systems out of the processor and placed them into a separate die. These were manufactured on a simpler, cheaper process node, while a more advanced one was used for the remaining logic and cache.And so, chiplets became the buzzword of choice.Smaller is betterTo understand exactly why AMD chose this direction, let's examine the image below. It showcases two older CPUs from the Ryzen 5 series the 2600 on the left, employing the so-called Zen+ architecture, and the Zen 2-powered 3600 on the right.The heat spreaders on both models have been removed, and the photographs were taken using an infrared camera. The 2600's single die houses eight cores, though two of them are disabled for this particular model.Source: Fritzchen FritzThis is also the case for the 3600, but here we can see that there are two dies in the package the Core Complex Die (CCD) at the top, housing the cores and cache, and the Input/Output Die (IOD) at the bottom containing all the controllers (for memory, PCI Express, USB, etc.) and physical interfaces.Since both Ryzen CPUs fit into the same motherboard socket, the two images are essentially to scale. On the surface, it might seem that the two dies in the 3600 have a larger combined area than the single chip in the 2600, but appearances can be deceiving.If we directly compare the chips containing the cores, it's clear how much space in the older model is taken up by analog circuitry it's all the blue-green colors surrounding the gold-colored cores and cache. However, in the Zen 2 CCD, very little die area is dedicated to analog systems; it's almost entirely composed of logic and SRAM.The Zen+ chip has an area of 213 mm and was manufactured by GlobalFoundries using its 12nm process node. For Zen 2, AMD retained GlobalFoundries' services for the 125 mm IOD but utilized TSMC's superior N7 node for the 73 mm CCD.Zen+ (top) vs Zen 2 CCD (bottom)The combined area of the chips in the newer model is smaller, and it also boasts twice as much L3 cache, supporting faster memory and PCI Express. The best part of the chiplet approach, however, was that the compact size of the CCD made it possible for AMD to fit another one into the package. This development gave birth to the Ryzen 9 series, offering 12 and 16-core models for desktop PCs.Even better, by using two smaller chips instead of one large one, each wafer can potentially yield more dies. In the case of the Zen 2 CCD, a single 12-inch (300 mm) wafer can produce up to 85% more dies than for the Zen+ model.The smaller the slice one takes out of a wafer, the less likely one is going to find manufacturing defects (as they tend to be randomly distributed across the disc), so taking all of this into account, the chiplet approach not only gave AMD the ability to expand its portfolio, it did so far more cost-effectively the same CCDs can be used in multiple models and each wafer produces hundreds of them!But if this design choice is so advantageous, why isn't Intel doing it? Why aren't we seeing it being used in other processors, like GPUs?Following the leadTo address the first question, Intel has been progressively adopting chiplet technology as well. The first consumer CPU architecture they shipped using chiplets is called Meteor Lake. Intel's approach is somewhat unique though, so let's explore how it differs from AMD's approach.Using the term tiles instead of chiplets, this generation of processors split the previously monolithic design into four separate chips:Compute tile: Contains all of the cores and L2 cacheGFX tile: Houses the integrated GPUSoC tile: Incorporates L3 cache, PCI Express, and other controllersIO tile: Accommodates the physical interfaces for memory and other devicesHigh-speed, low-latency connections are present between the SoC and the other three tiles, and all of them are connected to another die, known as an interposer. This interposer delivers power to each chip and contains the traces between them. The interposer and four tiles are then mounted onto an additional board to allow the whole assembly to be packaged.Unlike Intel, AMD does not use any special mounting die but has its own unique connection system, known as Infinity Fabric, to handle chiplet data transactions. Power delivery runs through a fairly standard package, and AMD also uses fewer chiplets. So why is Intel's design as such?One challenge with AMD's approach is that it's not very suitable for the ultra-mobile, low-power sector. This is why AMD still uses monolithic CPUs for that segment. Intel's design allows them to mix and match different tiles to fit a specific need. For example, budget models for affordable laptops can use much smaller tiles everywhere, while AMD only has one size chiplet for each purpose.The downside to Intel's system is that it's complex and expensive to produce (which has lead to different kind of issues). Both CPU firms, however, are fully committed to the chiplet concept. Once every part of the manufacturing chain is engineered around it, costs should decrease.When it comes to GPUs, they contain relatively little analog circuitry compared to the rest of the die. However, the amount of SRAM inside has been steadily increasing. This trend prompted AMD to leverage its chiplet expertise in the Radeon 7000 series, with the Radeon RX 7900 GPUs featuring a multi-die design. These GPUs include a single large die for the cores and L2 cache, along with five or six smaller dies, each containing a slice of L3 cache and a memory controller.By moving these components out of the main die, engineers were able to significantly increase the amount of logic without relying on the latest, most expensive process nodes to keep chip sizes manageable. While this innovation likely helped reduce overall costs, it did not significantly expand the breadth of AMD's graphics portfolio.Currently, Nvidia and Intel consumer GPUs are showing no signs of adopting AMD's chiplet approach. Both companies rely on TSMC for all manufacturing duties and seem content to produce extremely large chips, passing the cost onto consumers.That said, it is known that both are actively exploring and implementing chiplet-based architectures in some of their GPU designs. For example, Nvidia's Blackwell data center GPUs utilize a chiplet design featuring two large dies connected via a high-speed interlink capable of 10 terabytes per second, effectively functioning as a single GPU.Getting Moore with chipletsNo matter when these changes occur, the fundamental truth is that they must happen. Despite the tremendous technological advances in semiconductor manufacturing, there is a definite limit to how much each component can be shrunk.To continue enhancing chip performance, engineers essentially have two avenues add more logic, with the necessary memory to support it, and increase internal clock speeds. Regarding the latter, the average CPU hasn't significantly altered in this aspect for years. AMD's FX-9590 processor, from 2013, could reach 5 GHz in certain workloads, while the highest clock speed in its current models is 5.7 GHz (with the Ryzen 9 9950X).Intel's highest-clocked consumer CPU is the Core i9-14900KS, featuring a maximum turbo frequency of 6.2 GHz on two cores. This "special edition" processor holds the record for the fastest out-of-the-box clock speed among desktop CPUs.However, what has changed is the amount of circuitry and SRAM. The aforementioned AMD FX-9590 had 8 cores (and 8 threads) and 8 MB of L3 cache, whereas the 9950X boasts 16 cores, 32 threads, and 64 MB of L3 cache. Intel's CPUs have similarly expanded in terms of cores and SRAM.Nvidia's first unified shader GPU, the G80 from 2006, consisted of 681 million transistors, 128 cores, and 96 kB of L2 cache in a chip measuring 484 mm2 in area. Fast forward to 2022, when the AD102 was launched, and it now comprises 76.3 billion transistors, 18,432 cores, and 98,304 kB of L2 cache within 608 mm2 of die area.In 1965, Fairchild Semiconductor co-founder Gordon Moore observed that in the early years of chip manufacturing, the density of components inside a die was doubling each year for a fixed minimum production cost. This observation became known as Moore's Law and was later interpreted to mean "the number of transistors in a chip doubles every two years", based on manufacturing trends.Moore's Law has served as a reasonably accurate representation of the semiconductor industry's progress for nearly six decades. The tremendous gains in logic and memory in both CPUs and GPUs have largely been driven by continuous improvements in process nodes, with components becoming progressively smaller over time. However, this trend cannot can't continue forever, regardless of what new technology comes about.Rather than waiting for these physical limits to be reached, companies like AMD and Intel have embraced chiplet technology, exploring innovative ways to combine these modular components to sustain the creation of increasingly powerful processors.Decades in the future, the average PC might be home to CPUs and GPUs the size of your hand. But, peel off the heat spreader and you'll find a host of tiny chips not three or four, but dozens of them, all ingeniously tiled and stacked together. The dominance of the chiplet has only just begun.Keep Reading. Explainers at TechSpot

Transnistria is facing heating cuts after a halt in piped Russian natural gas supplies to Europe via Ukraine.The gas halt follows Ukraine's decision to not renew a gas transit contract with Russia.EU countries, like Slovakia, still rely on Russian gas, highlighting geopolitical risks.A European region is grappling with freezing temperatures in winter after Russian natural gas stopped flowing to Europe via Ukraine.On Monday, local energy company Tirasteploenergo warned residents in Transnistria, a breakaway region of Moldova, that heating and hot water services would be cut from 7 a.m. on Wednesday the first day of 2025.Hospitals and critical infrastructure still received heating, but the situation is precarious for Transnistria's population, which numbered about 475,000 at its last census in 2015.Tirasteploenergo advised residents to take basic measures to keep warm, as temperatures could dip to 23 degrees Fahrenheit in the capital city of Tiraspol in the coming days."To keep the room warm, seal the cracks in the windows and balcony doors, hang blankets or thick curtains over them. Place all family members in one room, temporarily closing the rest of the rooms," the company told customers.Tirasteploenergo also advised consumers to use electric heaters but to limit energy use."Dress warmly and take preventive medications for acute respiratory infections and flu," it added.A company employee told Reuters on Wednesday that she did not know how long the situation would persist. Tirasteploenergo did not respond immediately to a Business Insider request for comment outside regular business hours.The halt in services came following the termination of a five-year Russian gas transit to Europe via Ukraine after Kyiv refused to renew the deal over the war in Ukraine. The pipeline's shutdown marked the end of an era for Russia's oldest gas route to Europe.The cessation of gas supplies would hit Transnistria particularly hard since the region has been getting gas free of charge from Russian state-owned giant Gazprom.Transnistria declared a 30-day economic emergency last month ahead of the impending energy crisis.Moldova has also declared a 60-day state of emergency as the landlocked country still gets much of its gas from Transnistria.'A historic event'Ukrainian Energy Minister German Galushchenko hailed the halt of Russian gas to Europe as a "historic event.""Russia is losing its markets and will suffer financial losses," Galushchenko said in a Wednesday statement.The developments illustrate the region's geopolitical and economic entanglements with Russia, an energy giant.Many European Union countries have weaned themselves off Russian piped gas, which used to account for nearly 40% of the bloc's supply, but some like Slovakia and the Czech Republic are still reliant on Russian gas.The EU as a whole also still imports seaborne Russian liquefied natural gas.The Czech Republic a landlocked country that cut Russian piped gas imports in the summer of 2023 imported more of the fuel in 2024 because it was cheaper than LNG, Bloomberg reported in November.Meanwhile, Slovak Prime Minister Robert Fico appealed to the EU to find a way to keep Russian gas flowing via Ukraine. Slovakia made as much as 500 million euros, or $518 million, a year in Russian gas transit fees and would pay about 90 million euros more a year for alternative gas sources."Halting gas transit via Ukraine will have a drastic impact on us all in the EU but not on the Russian Federation," Fico said in his New Year's address.

Hanna Kim lost 22 pounds in a year when she changed her mindset toward weight loss.She tried fad diets for years but couldn't sustain them.Kim learned to be consistent, not perfect, and celebrate small wins.After years of trying to lose weight through restrictive diets that didn't work and left her feeling deflated, Hanna Kim lost 22 pounds in 2021 and has kept it off. She shared the two biggest lessons she learned.Kim, a 24-year-old YouTuber in Sydney, was stuck in a cycle of trying to lose weight through restrictive dieting, hating the process, giving up, and feeling like a failure. "It was just this endless negative loop," she told Business Insider.It was only when she started to question why it wasn't working and educate herself on sustainable weight loss that she made progress. She learned that there is no quick fix for weight loss, but making small, healthy changes and focusing on health over appearance makes a difference, she said.Previously, Kim led a fairly sedentary life, did no exercise, and ate a lot of fried food and takeout. She knew that jumping straight into a 45-minute HITT session would be overwhelming, but wanted to commit to some movement each day. She started by going on a 10-minute walk.She also calculated how many calories she could eat while remaining in a calorie deficit, the state where you burn more calories than you consume. Experts agree this is necessary for weight loss.She began to eat within her calorie budget, but she didn't cut out any foods. "I learned that I can be flexible with what I eat, so having a Kit Kat bar is fine as long as I'm within my calorie budget," she said. Hanna Kim didn't cut out any specific foods or food groups. Hanna Kim Weight loss can be enjoyableKim used to have a negative association with weight loss because it made her feel terrible about herself.But when she shifted her mindset to see it as an opportunity to invest in her long-term health and forming healthier habits, she saw it as a positive."It's a good thing. It's something that can be enjoyable and something that could be fun," she said.Over time, she grew to love exercise and eating a more nutritious diet because she went in with a curious mindset. "It's something you should wake up looking forward to. What am I going to learn new today? What new recipe can I make today? What exercise is going to make me feel good today?" she said.She saw the journey as a way to work on herself more generally and find what made her feel good mentally and physically.It's not about perfection Over time, Hanna Kim fell in love with exercise. Hanna Kim Kim learned to take things slow and let go of perfectionism by accepting that she won't be able to stick to her regime 100%. By giving herself grace when she did eat more than her calorie budget for example, she was able to keep going on her health journey rather than give up like she had in the past."It's going to be a long-term investment, and everything that I do is ultimately going to make a difference," she said.She found that being consistent was more important than being perfect and she celebrated "small wins" along the way.

The subsea cables that underpin the internet are at risk of Russian attack.The West is seeking to defend the cables, but it's a tough task.NATO has a backup plan to reroute some data through space.For decades, a vast network of largely undefended subsea cables has underpinned the internet. It's looking more and more vulnerable.A series of recent mysterious cases of cables severed in the Baltic Sea, blamed by Western officials on Russian sabotage, has highlighted their exposure to attack.On Christmas Day, a Baltic undersea power cable and several telecommunications cables were severed underscoring the threat.Officials in Finland are investigating a Russia-linked tanker, that they say may have severed the cables by dragging its anchor for dozens of miles across the seabed.The incidents have sparked a race to safeguard the infrastructure, whose security many analysts say has been neglected.Planning a HEISTAt the forefront is a NATO-funded project: the Hybrid Space/Submarine Architecture Ensuring Information Security of Telecommunications, or HEIST.The initial test project is due to cost some $2 million, including $400,000 from NATO. It is being developed by academics alongside the satellite broadband firms Viasat and SpaceX.If tests are successful, countries and companies would then buy into the network to fund a much wider rollout.'Redefine the backbone of the internet'The core idea is simple: To use satellites to transmit some data, making the West less reliant on undersea cables."Our ultimate ambition is to redefine the backbone of the internet," said Gregory Falco, an engineering professor at Cornell University working on HEIST."Instead of requiring all of our data to flow through subsea cables (of which 95% of the internet is reliant on) we would like to enable an ecosystem of options," he said."While one may argue that submarine communication cables are very efficient, they are not very resilient to natural or human-made threats.""Overall, any measures to increase the resilience of our communications architecture is fundamentally needed. The multilayered approach of the HEIST program is a good start," Melanie Garson, Associate Professor in Conflict Resolution & International Security at University College London told BI.Backup and deterrentThe plan works by fitting existing cables with sensors to detect disruptions, either from sabotage or natural events and accidents.In an outage, they would automatically re-route the data via a network of satellites.It could act as a deterrent, giving hostile vessels less incentive to approach the cables in the first place.Falco said the tech would be tested in January. From there, the plan is to have "end-to-end functional capability" by December 2026, he said. Fiber optic cables on the floor of the Mediterranean Sea. Sybille Reuter via Getty images SpaceX already has its vast network of Starlink satellites beaming internet around the world to commercial customers and some militaries. But the service doesn't feature the rerouting concept HEIST is investigating.Neither SpaceX or Viasat responded to requests for comment from Business Insider.The threat to the cables is intensifyingIn the meantime, Russia poses a threat to the cables, and has a motive to damage them.Russia, analysts say, could seek to punish the West for its support for Ukraine by targeting crucial infrastructure like the cables.Business Insider in August reported that a secret Russian undersea sabotage unit, the GUGI, had been surveilling the cables, which analysts warned that the West is ill-equipped to defend.Space is dangerous, tooThough having two methods is better than one, satellites are hardly immune from disruption themselves.Space weather events and collisions with debris (including manmade "space junk") can damage satellites as well as attacks by rival powers like China.Russia, for its part, would likely target satellites if direct fighting were ever to break out between it and the US, experts have warned.In response, the race is on to defend satellite systems as well, with the Pentagon seeking to employ anti-jamming technology should they come under attack.Falco told BI a key part of the HEIST project ensuring the backup satellites themselves were secure, too.PrioritiesAnd there are formidable technical challenges.A combination of satellites and subsea cables has long been used for communicating highly sensitive data. However, figuring out how to reroute the data is a challenge on a different scale.Falco said that, at first, HEIST would need to focus on the highest-priority data because it would be impossible to transfer everything.Another computer science expert working on HEIST, Professor Henric Johnson of the Blekinge Institute of Technology, agreed that the challenge was substantial.He cited the complexity of integrating the technology into existing infrastructure while staying ahead of quickly evolving threats."Adversaries are continuously developing new attack vectors, such as exploiting supply chain weaknesses or leveraging advanced AI tools, which require ongoing updates and refinements to the system," he said.Johnson said that HEIST shouldn't be seen as a quick fix but as part of an ongoing process to secure Western infrastructure."It's important to acknowledge that security is a continuous process. HEIST is not a one-time solution but part of an evolving strategy to adapt to emerging risks," he said.NATO did not respond to a request for comment by the time of publication.

Brava House / MadeiguinchoSave this picture! Joo CarrancaArchitects: MadeiguinchoYearCompletion year of this architecture project Year: 2023 PhotographsPhotographs:Joo Carranca Lead Architects: Gonalo Marrote, Joo Filipe, Hugo Santos, Rui Peixoto, Sander More SpecsLess SpecsSave this picture!Text description provided by the architects. This tiny house on wheels, designed for an artist and her daughter, harmonizes with the serene beauty of a cork oak forest. The exterior is clad in charred Japanese cedar, providing a striking, durable finish that blends seamlessly with the natural surroundings. Large openings made of thermowood enhance this connection to nature, allowing for panoramic views and ample natural light. These openings create a seamless transition between the cozy interior and the lush outdoors, making the forest an integral part of the living experience.Save this picture!Save this picture!Save this picture!Inside, the tiny house is both functional and inviting. The living room, which can also serve as a sleeping area for guests, is the heart of the home, featuring versatile seating and expansive thermowood-framed windows that bring the outdoors in. A lofted sleeping area is accessed by an elegant staircase crafted from exotic wood, adding a touch of sophistication. Under the staircase and loft, the compact kitchen and bathroom are efficiently designed with birch plywood cabinetry, offering modern amenities and a clean, minimalist aesthetic. The Portuguese pine flooring throughout adds warmth and durability, enhancing the overall sense of coziness and comfort in this beautifully integrated, nature-focused retreat.Save this picture!Project gallerySee allShow lessAbout this officeMadeiguinchoOfficePublished on January 02, 2025Cite: "Brava House / Madeiguincho" [Brava Tiny House / Madeiguincho] 02 Jan 2025. ArchDaily. Accessed . <https://www.archdaily.com/1025024/brava-house-madeiguincho&gt ISSN 0719-8884Save!ArchDaily?You've started following your first account!Did you know?You'll now receive updates based on what you follow! Personalize your stream and start following your favorite authors, offices and users.Go to my stream

SUPRA* Pavilion / SO? Architecture and IdeasSave this picture! Oral GktaPavilionSuseong District, South KoreaArchitects: SO? Architecture and IdeasAreaArea of this architecture projectArea:40 mYearCompletion year of this architecture project Year: 2024 PhotographsPhotographs:Oral Gkta Lead Architects: Oral Gkta More SpecsLess SpecsSave this picture!SUPRA* *opposite of infra. Supra refers to what is above and infra to what is below.The dilemma between nature and urbanism has been a prominent topic for decades, particularly with the rise of discussions about the Anthropocene. Cities developed rapidly in the last decades, making the perpetual cycle of nature less visible in high-density urban areas. This change transforms the relationship between humans and nature, as understanding through seeing becomes harder.Save this picture!Save this picture!As newcomers to Seoul and Suseong, we've observed the human-nature relationship, noting that, unlike in Istanbul, natural resources like mountains, rivers, and winds are still tangible in Korean cities, despite technology taking precedence. Our project site, surrounded by high-density development, highways, water, and greenery, exemplifies this juxtaposition. The noise of passing cars contrasts with the serene lotus flowers floating on the lake, illustrating different experiences of time and change. Moreover, it is common in Korean architecture to use natural materials in relation to each other. Stones are paired with wood, mimicking their natural coexistence.Save this picture!Given these observations, we ask how one can have a moment of self-reflection amidst this dilemma. We propose a simple canopy that provides privacy in public spaces, allowing for relaxation. The canopy's materials and details create an urban interior feeling, offering privacy without creating enclosed, high-maintenance spaces. When it rains, SUPRA aims to make the movement of water visible, from the air to the soil. When it does not rain, SUPRA provides a space where people can be privately public, as described by Marshall Berman, intimately together without being physically alone.Save this picture!The theme of the biennial "relational field" underlies our design, when someone sits by a rock under a canopy during lunch break and has a moment of self-reflection, hearing the noises of the motorway while watching the drifting clouds. Save this picture!Project gallerySee allShow lessProject locationAddress:Suseong District, South KoreaLocation to be used only as a reference. It could indicate city/country but not exact address.About this officePublished on January 02, 2025Cite: "SUPRA* Pavilion / SO? Architecture and Ideas" 02 Jan 2025. ArchDaily. Accessed . <https://www.archdaily.com/1025166/supra-star-pavilion-so-architecture-and-ideas&gt ISSN 0719-8884Save!ArchDaily?You've started following your first account!Did you know?You'll now receive updates based on what you follow! Personalize your stream and start following your favorite authors, offices and users.Go to my stream

Quick robot modeled using the Random Flow addon in Blender.Shops:blendermarket.com/creators/blenderguppygumroad.com/blenderguppyPatreon:patreon.com/blenderguppy#shorts #b3d #blender3d #3d #3dmodeling #blendermarket #conceptartist #3dmodel #blenderaddon #3dmodel

In this video, I will show you how to bake details created by Random Flow into texture maps using Greeble Bake.More about the redo panel here: https://www.blenderguppy.com/add-ons/other-information/redo-panel Get these tools here:https://gumroad.com/blenderguppy https://blendermarket.com/creators/blenderguppy Become my Patron:https://patreon.com/blenderguppy Follow me:https://facebook.com/blenderguppy https://instagram.com/blenderguppy https://twitter.com/blenderguppy #b3d #3d #3dmodeling #3dtexturing #blendermarket #conceptart #spaceship

Project Files: https://www.patreon.com/CodeLikeMe/shop/shootlikeme-unreal-engine-third-person-258727 . Here is the Shootlikeme - Third person shooter project updated into unreal engine 5.5. ShootLikeMe is a project that I have been working on since 2020 and my goal was to create a third person shooter template project in unreal engine that is capable enough to create any kind of a third person shooter game you need. In this project, there are 13 different fully functioning weapons with all the sounds, muzzle flashes and damaging and can be used by both player and NPC AI characters.Weapons:- AK47- M16- MP5- Machine Gun- Uzi- M1870 bolt action rifle- Shotgun- Sniper- Pistol- Revolver- Crossbow- Flamethrower- Rocket LauncherApart from main weapons, there are 3 different grenade types- Grenades- Flashbangs/ Stun grenades- Smoke grenades- Regular grenadesAnd there are advanced AI behaviors implemented into NPC enemy character with support for multiple factions. That means, we can simulate a war between 2 or more factions with AI fighting both AI and player. There can be Ally and Enemy NPCs.Also there are searchlight systems, helicopters, traps, explosive barrels, alarms and many more features that you would need to create a complete game.You can watch and learn how each and every system is implemented from scratch following the free tutorial series I have published in my channel. CodeLikeMe Third-Person shooter series: https://www.youtube.com/playlist?list=PLNTm9yU0zou4HL7SAyIQoCqJRJ5QeQAl8 // ! https://www.patreon.com/codelikeme Patrons will have access to project files of all the stuff I do in the channel and other extra benefitsJoin this channel to get access to perks:https://www.youtube.com/channel/UClb6Jh9EBV7a_Nm52Ipll_Q/join Like my facebook page for more content : https://www.facebook.com/gamedevelopersclub/ Follow me on twitter : https://twitter.com/CodeLikeMe2 Follow me on reddit : https://www.reddit.com/user/codelikeme #CodeLikeMe #unrealengine #ue5 #indiegamedev

Nature, Published online: 01 January 2025; doi:10.1038/s41586-024-08286-zThe resistivity structure of Yellowstone Calderas crustal magma reservoir indicates that the magma reservoirs are not eruptible at present and that the locus of future volcanism has shifted to northeast Yellowstone Caldera.